SCHEMBL22493529

SCHEMBL22493529

C=CCCCCCCCCCCCC(C)Cl

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.48
ALDH1A1 P00352 4/20 0.40
TRPA1 O75762 2/20 0.39
USP2 O75604 4/20 0.39
MAPT P10636 3/20 0.39
CYP3A4 P08684 2/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
HPGD P15428 1/20 0.39
ABCC4 O15439 1/20 0.37
LMNA P02545 2/20 0.36
RECQL P46063 1/20 0.33
LPAR3 Q9UBY5 2/20 0.32
LPAR2 Q9HBW0 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22493524 1.00 TSHR (0.48) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL18454052 1.00 TSHR (0.48) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL22493558 1.00 TSHR (0.48) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL22493530 1.00 TSHR (0.48) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL22493553 1.00 TSHR (0.48) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL22493544 1.00 TSHR (0.48) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL11063317 0.98
SCHEMBL11065592 0.90
SCHEMBL9220719 0.80 TSHR (0.52) TSHRALDH1A1TRPA1USP2MAPT
SCHEMBL2998034 0.80 TSHR (0.52) TSHRALDH1A1TRPA1USP2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11111348-B2 Method for treating surface of resin material layer and resin material MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) 2021-09-07 US disclosed
EP-3450488-B1 METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL MITSUBISHI HEAVY IND LTD (JP) 2021-03-24 EP disclosed
US-20200317876-A1 METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) 2020-10-08 US disclosed