SCHEMBL224984

SCHEMBL224984

O=[Ir].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL37413 0.89
SCHEMBL28816476 0.89
SCHEMBL6375422 0.89
SCHEMBL27758142 0.87
SCHEMBL25031 0.87
SCHEMBL10851569 0.75
SCHEMBL19125171 0.75
SCHEMBL18689802 0.75
SCHEMBL10848443 0.75
SCHEMBL1988041 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122081843-A Teflon coating and spraying process thereof 2026-05-26 CN claimed
EP-3719179-B1 PLATING APPARATUS AND PLATING METHOD MITSUBISHI ELECTRIC CORP (JP) 2025-07-02 EP claimed
CN-111373078-B Plating apparatus and plating method 三菱电机株式会社 2022-10-04 CN claimed
CN-114324543-A Electrode and use thereof 富佳生技股份有限公司 2022-04-12 CN claimed
US-20200332430-A1 PLATING APPARATUS AND PLATING METHOD MITSUBISHI ELECTRIC CORPORATION (JP) 2020-10-22 US claimed
EP-3719179-A1 PLATING APPARATUS AND PLATING METHOD Mitsubishi Electric Corporation (JP) 2020-10-07 EP claimed
CN-111373078-A Plating apparatus and plating method 三菱电机株式会社 2020-07-03 CN claimed
CN-204779822-U Use electroreduction regeneration chlorine absorbing device SHENZHEN JECH TECHNOLOGY CO LTD 2015-11-18 CN claimed
US-20100065421-A1 MEMBRANE ELECTROLYTIC REACTORS SYSTEM WITH FOUR CHAMBERS E.C.A.S. SRL (IT) 2010-03-18 US claimed
CN-122081843-A Teflon coating and spraying process thereof 2026-05-26 CN disclosed
EP-3719179-B1 PLATING APPARATUS AND PLATING METHOD MITSUBISHI ELECTRIC CORP (JP) 2025-07-02 EP disclosed
WO-2025015216-A2 METHODS AND SYSTEMS FOR ELECTROCHEMICAL PRECIPITATION OF BRUCITE FOR CARBON CAPTURE AND STORAGE MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2025-01-16 WO disclosed
CN-221940662-U Copper plating system for conductive film 江阴纳力新材料科技有限公司 2024-11-01 CN disclosed
CN-118422280-A Manufacturing method of electrolytic copper foil titanium anode and titanium anode 陕西汉和新材料科技有限公司 2024-08-02 CN disclosed
WO-2006086435-A2 DEVICES AND METHODS FOR ACCELEROMETER-BASED CHARACTERIZATION OF CARDIAC FUNCTION AND MONITORING OF FREQUENCY DYNAMICS OF THE ISOV CARDIOSYNC, INC. (US) 2006-08-17 WO disclosed
US-20060178586-A1 Devices and methods for accelerometer-based characterization of cardiac function and identification of LV target pacing zones CARDIO-SYNC, INC. 2006-08-10 US disclosed
CN-1523135-A Process for preparing tetramethyl ammonium hydroxide by electrolysis-electrodialysis �Ͼ���ҵ��ѧ 2004-08-25 CN disclosed
US-4528084-A Electrode with electrocatalytic surface ELTECH SYSTEMS CORPORATION (US) 1985-07-09 US disclosed
EP-0046447-B1 ELECTRODE WITH ELECTROCATALYTIC SURFACE AND METHOD OF MANUFACTURE ELTECH SYSTEMS CORPORATION (US) 1984-12-05 EP disclosed
EP-0046447-A1 Electrode with electrocatalytic surface and method of manufacture ELTECH SYSTEMS CORPORATION (US) 1982-02-24 EP disclosed