Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL22553720

CC1CCCCC1(N)N.N.N

nearest known ligand 0.44

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Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
SLC6A4 P31645 1/20 0.32
SLC6A3 Q01959 1/20 0.32
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL28561202 1.00 SLC6A4 (0.32) SLC6A4SLC6A3MAPT
SCHEMBL221041 0.97
SCHEMBL28135023 0.95 SLC6A4 (0.32) SLC6A4SLC6A3MAPT
SCHEMBL7592374 0.89
SCHEMBL20680718 0.88 SLC6A4 (0.33) SLC6A4SLC6A3
Bicarbonate SCHEMBL31504050 0.86 EPHX1 (0.34)
SCHEMBL7156971 0.78
SCHEMBL28399941 0.78 KMT2A (0.34)
SCHEMBL7156973 0.78
Ammonia Solution, Strong SCHEMBL2029124 0.77 SLC6A4 (0.31) SLC6A4SLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11649351-B2 Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same SHENGYI TECHNOLOGY CO., LTD. (CN) 2023-05-16 US claimed
EP-3730532-B1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME SHENGYI TECHNOLOGY CO LTD (CN) 2022-02-23 EP claimed
EP-3730532-A1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME Shengyi Technology Co., Ltd. (CN) 2020-10-28 EP claimed
US-20200332109-A1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2020-10-22 US claimed
US-11649351-B2 Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same SHENGYI TECHNOLOGY CO., LTD. (CN) 2023-05-16 US disclosed
EP-3730532-B1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME SHENGYI TECHNOLOGY CO LTD (CN) 2022-02-23 EP disclosed
CN-113402306-A Preparation method of ceramic surface full-covered metal layer 江苏濠玥电子科技有限公司 2021-09-17 CN disclosed
EP-3730532-A1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME Shengyi Technology Co., Ltd. (CN) 2020-10-28 EP disclosed
US-20200332109-A1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2020-10-22 US disclosed
CN-110791186-A Weather-proof bulletproof paint and preparation method thereof 中国建材检验认证集团厦门宏业有限公司 2020-02-14 CN disclosed