SCHEMBL22613591

SCHEMBL22613591

O=S(=O)(O)CCCOCC1COc2cscc2O1.[KH]

nearest known ligand 0.36

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
S1PR1 P21453 2/20 0.33
SGPL1 O95470 1/20 0.33
CYP2D6 P10635 1/20 0.31
L3MBTL1 Q9Y468 2/20 0.31
TSHR P16473 2/20 0.31
MAPK1 P28482 1/20 0.31
RECQL P46063 1/20 0.31
MAPT P10636 1/20 0.31
ALDH1A1 P00352 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9896132 0.99 S1PR1 (0.33) S1PR1SGPL1CYP2D6L3MBTL1TSHR
SCHEMBL9896958 0.98 S1PR1 (0.33) S1PR1SGPL1CYP2D6L3MBTL1TSHR
SCHEMBL22613567 0.96 TSHR (0.33) S1PR1SGPL1CYP2D6L3MBTL1TSHR
SCHEMBL2529199 0.95 TSHR (0.34) S1PR1SGPL1CYP2D6L3MBTL1TSHR
SCHEMBL1631865 0.94 TSHR (0.33) S1PR1SGPL1CYP2D6L3MBTL1TSHR
SCHEMBL26131918 0.88 SMN1; SMN2 (0.37) S1PR1SGPL1RECQLALDH1A1SMN1; SMN2
Potassium Ion SCHEMBL21360089 0.86 CYP2D6 (0.32) S1PR1SGPL1CYP2D6TSHR
SCHEMBL9896957 0.85 CYP2D6 (0.31) S1PR1SGPL1CYP2D6TSHR
Potassium Ion SCHEMBL29661253 0.85 CYP2D6 (0.31) S1PR1SGPL1CYP2D6TSHR
SCHEMBL21359780 0.85 CYP2D6 (0.31) S1PR1SGPL1CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3744794-B1 ELECTROCONDUCTIVE COMPOSITION AND PRODUCTION METHOD THEREFOR, AND WATER-SOLUBLE POLYMER AND PRODUCTION METHOD THEREFOR MITSUBISHI CHEM CORP (JP) 2024-04-17 EP disclosed
EP-3581622-B1 CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING CONDUCTIVE COMPOSITION, AND METHOD FOR PRODUCING CONDUCTOR MITSUBISHI CHEM CORP (JP) 2023-07-26 EP disclosed
US-20230135022-A1 CONDUCTIVE COMPOSITION AND PRODUCTION METHOD THEREFOR, AND WATER-SOLUBLE POLYMER AND PRODUCTION METHOD THEREFOR MITSUBISHI CHEMICAL CORPORATION (JP) 2023-05-04 US disclosed
US-20230107107-A1 CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING CONDUCTIVE COMPOSITION, AND METHOD FOR PRODUCING CONDUCTOR MITSUBISHI CHEMICAL CORPORATION (JP) 2023-04-06 US disclosed
US-11572479-B2 Conductive composition and production method therefor, and water-soluble polymer and production method therefor MITSUBISHI CHEMICAL CORPORATION (JP) 2023-02-07 US disclosed
CN-111819637-B Conductive film and method for producing same, conductive body, method for forming resist pattern, and laminate 三菱化学株式会社 2022-05-31 CN disclosed
EP-3767639-A1 CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, CONDUCTOR, RESIST PATTERN FORMATION METHOD, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2021-01-20 EP disclosed
US-20210005343-A1 CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, CONDUCTOR, RESIST PATTERN FORMATION METHOD, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2021-01-07 US disclosed
EP-3744794-A1 ELECTROCONDUCTIVE COMPOSITION AND PRODUCTION METHOD THEREFOR, AND WATER-SOLUBLE POLYMER AND PRODUCTION METHOD THEREFOR Mitsubishi Chemical Corporation (JP) 2020-12-02 EP disclosed
US-20200347244-A1 CONDUCTIVE COMPOSITION AND PRODUCTION METHOD THEREFOR, AND WATER-SOLUBLE POLYMER AND PRODUCTION METHOD THEREFOR MITSUBISHI CHEMICAL CORPORATION (JP) 2020-11-05 US disclosed
CN-111819637-A Conductive film and method for producing same, conductive body, method for forming resist pattern, and laminate 三菱化学株式会社 2020-10-23 CN disclosed
CN-111615540-A Conductive composition and method for producing same, and water-soluble polymer and method for producing same 三菱化学株式会社 2020-09-01 CN disclosed