SCHEMBL2264878

SCHEMBL2264878

CO[Si](OC)(OC)C(NC(C(C)C)[Si](OC)(OC)OC)C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7007796 0.85
SCHEMBL201225 0.80
SCHEMBL7007798 0.69
SCHEMBL11908489 0.69
SCHEMBL9319679 0.65
SCHEMBL574803 0.65
SCHEMBL3245310 0.65
SCHEMBL104938 0.63
SCHEMBL314498 0.63
SCHEMBL17784253 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2231740-B1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2011-08-24 EP claimed
WO-2023176768-A1 EPOXY RESIN COMPOSITION, COMPOSITION FOR METAL SURFACE PROCESSING, METHOD FOR PRODUCING LAYERED METAL SHEET, AND METHOD FOR BONDING METAL SHEET 株式会社ADEKA 2023-09-21 WO disclosed
EP-2137198-B1 EPOXYSILANES, PROCESSES FOR THEIR MANUFACTURE AND CURABLE COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2016-05-18 EP disclosed
US-7989651-B2 trimethoxysilylpropyl-carbamic acid oxiranylmethyl ester; reacting glycidol with gamma-isocyanatopropyltriethoxysilane in presence of dibutyltin laurate catalyst MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-08-02 US disclosed
EP-2137198-A1 EPOXYSILANES, PROCESSES FOR THEIR MANUFACTURE AND CURABLE COMPOSITIONS CONTAINING SAME Momentive Performance Materials Inc. (US) 2009-12-30 EP disclosed
WO-2008112150-A1 EPOXYSILANES, PROCESSES FOR THEIR MANUFACTURE AND CURABLE COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-09-18 WO disclosed
US-20080221238-A1 Epoxysilanes, processes for their manufacture and curable compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. 2008-09-11 US disclosed