SCHEMBL2267320

SCHEMBL2267320

CCN[SiH](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylamine SCHEMBL15233839 0.89
SCHEMBL2104416 0.75
SCHEMBL2099769 0.72
SCHEMBL20377936 0.72 TP53 (0.31)
SCHEMBL180627 0.70 TP53 (0.36)
SCHEMBL15309954 0.69
SCHEMBL2101798 0.69
SCHEMBL2102045 0.65
SCHEMBL2276680 0.65
SCHEMBL2269101 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113936994-A Selective deposition of thin film dielectrics using surface termination chemistry 应用材料公司 2022-01-14 CN claimed
CN-107533951-B Selective deposition of thin film dielectrics using surface termination chemistry 应用材料公司 2021-10-26 CN claimed
US-20180199432-A1 Selective Deposition of Thin Film Dielectrics Using Surface Blocking Chemistry APPLIED MATERIALS, INC. 2018-07-12 US claimed
US-9911591-B2 Selective deposition of thin film dielectrics using surface blocking chemistry APPLIED MATERIALS, INC. (US) 2018-03-06 US claimed
US-20160322213-A1 Selective Deposition Of Thin Film Dielectrics Using Surface Blocking Chemistry APPLIED MATERIALS, INC. 2016-11-03 US claimed
US-9153597-B2 Methods of manufacturing a three-dimensional semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-10-06 US claimed
US-20130078776-A1 Methods of Manufacturing a Three-Dimensional Semiconductor Device SAMSUNG ELECTRONICS CO., LTD. 2013-03-28 US claimed
CN-119604963-A Hybrid atomic layer deposition 朗姆研究公司 2025-03-11 CN disclosed
CN-119487614-A Deposition and etching of silicon-containing layers 朗姆研究公司 2025-02-18 CN disclosed
CN-119213530-A Low-k dielectric protection during plasma deposition of silicon nitride 朗姆研究公司 2024-12-27 CN disclosed
CN-119213529-A Seamless and crack-free deposition 朗姆研究公司 2024-12-27 CN disclosed
US-20240030026-A1 PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2024-01-25 US disclosed
WO-2022264430-A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM 株式会社KOKUSAI ELECTRIC 2022-12-22 WO disclosed
US-4730074-A Vapor phase alcoholysis of aminosilanes and carbamatosilanes UNION CARBIDE CORPORATION (US) 1988-03-08 US disclosed
EP-0098912-B1 PROCESS FOR THE PREPARATION OF ALKOXYHYDRIDOSILANES UNION CARBIDE CORPORATION (US) 1986-04-23 EP disclosed
EP-0098911-B1 IMPROVED PROCESS FOR THE PREPARATION OF OXIMATOHYDRIDOSILANES AND AMINOXYHYDRIDOSILANES UNION CARBIDE CORPORATION (US) 1986-04-16 EP disclosed
EP-0098911-A1 Improved process for the preparation of oximatohydridosilanes and aminoxyhydridosilanes UNION CARBIDE CORPORATION (US) 1984-01-25 EP disclosed
EP-0098912-A1 Process for the preparation of alkoxyhydridosilanes UNION CARBIDE CORPORATION (US) 1984-01-25 EP disclosed
US-4395564-A REACTING AN ALCOHOL WITH SILYL-AMINE UNION CARBIDE CORPORATION (US) 1983-07-26 US disclosed
US-4384131-A Process for the preparation of oximatohydridosilanes and aminoxyhydridosilanes UNION CARBIDE CORPORATION (US) 1983-05-17 US disclosed