⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8650471 | 1.00 | — | — | |
| SCHEMBL8654085 | 0.83 | — | — | |
| SCHEMBL3482232 | 0.83 | — | — | |
| SCHEMBL38658989 | 0.80 | LPAR2 (0.41) | — | |
| SCHEMBL5968654 | 0.78 | TSHR (0.41) | — | |
| SCHEMBL5968664 | 0.78 | TSHR (0.41) | — | |
| SCHEMBL2102782 | 0.75 | KCNH2 (0.31) | — | |
| SCHEMBL727601 | 0.74 | — | — | |
| SCHEMBL727599 | 0.74 | — | — | |
| SCHEMBL727600 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105873985-A | Method for capping mq-type silicone resins | 道康宁公司 | 2016-08-17 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-0879822-A2 | Method for preparation of alkenylsilanes | DOW CORNING CORPORATION (US) | 1998-11-25 | — | — | EP | disclosed |
| US-5808126-A | RING OPENING METATHESIS POLYMERIZATION; SILYLATION, CATALYSIS, ENDCAPPING | DOW CORNING CORPORATION (US) | 1998-09-15 | — | — | US | disclosed |
| US-5756796-A | Method for preparation of alkenylsilanes | DOW CORNING CORPORATION (US) | 1998-05-26 | — | — | US | disclosed |