SCHEMBL2273393

SCHEMBL2273393

C=C[SiH](CC)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2272203 0.78
SCHEMBL28067663 0.78
SCHEMBL2267185 0.74
SCHEMBL2269821 0.74 TSHR (0.35)
SCHEMBL5084632 0.70
SCHEMBL27758615 0.70
SCHEMBL5088949 0.67 TSHR (0.33)
SCHEMBL2272528 0.61
SCHEMBL2104098 0.61
SCHEMBL2269407 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020196886-A1 CONJUGATED DIENE COPOLYMER AND METHOD FOR MANUFACTURING CONJUGATED DIENE COPOLYMER ZSエラストマー株式会社 2020-10-01 WO disclosed
CN-109906235-A Produce method, rubber and the composition based on it of the modified rubber containing diene 公共型股份公司希布尔控股 2019-06-18 CN disclosed
CN-103917590-B Rubber combination and studless tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2016-06-01 CN disclosed
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
CN-1329470-C Binding composition, electric circuit connecting material, electric component connecting structure and production thereof HITACHI CHEMICAL CO LTD (JP) 2007-08-01 CN disclosed
CN-1680507-A Binding composition, electric circuit connecting material, electric component connecting structure and production thereof HITACHI CHEMICAL CO LTD (JP) 2005-10-12 CN disclosed