SCHEMBL2274515

SCHEMBL2274515

C=NC(CN)CN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30988434 0.65
SCHEMBL765232 0.61
SCHEMBL22072579 0.59
SCHEMBL5176960 0.56
SCHEMBL10028832 0.56
SCHEMBL23877972 0.53
SCHEMBL21222729 0.53
SCHEMBL94354 0.53
SCHEMBL10779962 0.53
SCHEMBL63866 0.52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8003587-B2 Semiconductor process residue removal composition and process EKC TECHNOLOGY, INC. (US) 2011-08-23 US claimed
US-20090203566-A1 Semi Conductor Process Residue Removal Composition and Process EKC TECHNOLOGY, INC. 2009-08-13 US claimed
US-6492311-B2 REMOVING PHOTORESIST RESIDUE; DOES NOT CORRODE OR ATTACK TITANIUM OR OTHER METALLURGY, OXIDE OR NITRIDE LAYERS ON THE SUBSTRATE EKC TECHNOLOGY, INC. 2002-12-10 US claimed
US-6367486-B1 REMOVES PHOTORESIST AND OTHER RESIDUE FROM INTEGRATED CIRCUIT SUBSTRATES. EKC TECHNOLOGY, INC. 2002-04-09 US claimed
US-8003587-B2 Semiconductor process residue removal composition and process EKC TECHNOLOGY, INC. (US) 2011-08-23 US disclosed
US-20090203566-A1 Semi Conductor Process Residue Removal Composition and Process EKC TECHNOLOGY, INC. 2009-08-13 US disclosed
US-7528098-B2 Semiconductor process residue removal composition and process EKC TECHNOLOGY, INC. (US) 2009-05-05 US disclosed
US-20090099051-A1 Aqueous fluoride compositions for cleaning semiconductor devices EKC TECHNOLOGY, INC. 2009-04-16 US disclosed
EP-1576072-B1 AQUEOUS PHOSPHORIC ACID COMPOSITIONS FOR CLEANING SEMICONDUCTOR DEVICES EKC TECHNOLOGY INC (US) 2008-08-20 EP disclosed
US-7399365-B2 Aqueous fluoride compositions for cleaning semiconductor devices EKC TECHNOLOGY, INC. (US) 2008-07-15 US disclosed
US-7235188-B2 Aqueous phosphoric acid compositions for cleaning semiconductor devices EKC TECHNOLOGY, INC. (US) 2007-06-26 US disclosed
EP-1576072-A4 AQUEOUS PHOSPHORIC ACID COMPOSITIONS FOR CLEANING SEMICONDUCTOR DEVICES EKC TECHNOLOGY INC (US) 2006-05-17 EP disclosed
WO-2003104185-A1 SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS EKC TECHNOLOGY, INC. (US) 2003-12-18 WO disclosed
US-20030228990-A1 Semiconductor process residue removal composition and process EKC TECHNOLOGY, INC. 2003-12-11 US disclosed
US-6492311-B2 REMOVING PHOTORESIST RESIDUE; DOES NOT CORRODE OR ATTACK TITANIUM OR OTHER METALLURGY, OXIDE OR NITRIDE LAYERS ON THE SUBSTRATE EKC TECHNOLOGY, INC. 2002-12-10 US disclosed
US-6367486-B1 REMOVES PHOTORESIST AND OTHER RESIDUE FROM INTEGRATED CIRCUIT SUBSTRATES. EKC TECHNOLOGY, INC. 2002-04-09 US disclosed
US-20010006936-A1 ETHYENEDIAMINETETRAACETIC ACID OR ITS AMMONIUM SALT SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS EKC TECHNOLOGY, INC. 2001-07-05 US disclosed
EP-0975731-A4 ETHYLENEDIAMINETETRAACETIC ACID OR ITS AMMONIUM SALT SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS EKC TECHNOLOGY INC (US) 2001-02-07 EP disclosed
EP-0975731-A1 ETHYLENEDIAMINETETRAACETIC ACID OR ITS AMMONIUM SALT SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS EKC TECHNOLOGY, INC. (US) 2000-02-02 EP disclosed
WO-1998045399-A1 ETHYLENEDIAMINETETRAACETIC ACID OR ITS AMMONIUM SALT SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS EKC TECHNOLOGY, INC. (US) 1998-10-15 WO disclosed