Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3233916 | 0.78 | — | — | |
| SCHEMBL15610529 | 0.74 | — | — | |
| SCHEMBL27703328 | 0.74 | TSHR (0.33) | HIF1AHTT | |
| SCHEMBL5155222 | 0.72 | HIF1A (0.32) | HIF1AHTT | |
| SCHEMBL28247212 | 0.71 | SMN1; SMN2 (0.38) | HTT | |
| SCHEMBL9159787 | 0.69 | — | — | |
| SCHEMBL1144851 | 0.67 | CYP1A2 (0.35) | — | |
| SCHEMBL221076 | 0.67 | — | — | |
| SCHEMBL29286374 | 0.67 | SMN1; SMN2 (0.36) | — | |
| SCHEMBL7070122 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108015299-A | Nano-Ag particles and preparation method thereof | 珠海纳金科技有限公司 | 2018-05-11 | — | — | CN | claimed |
| US-7332193-B2 | Cobalt and nickel electroless plating in microelectronic devices | ENTHONE, INC. (US) | 2008-02-19 | — | — | US | claimed |
| CN-101080280-A | Cobalt and nickel electroless plating in microelectronic devices | ENTHONE (US) | 2007-11-28 | — | — | CN | claimed |
| EP-1807218-A1 | COBALT AND NICKEL ELECTROLESS PLATING IN MICROELECTRONIC DEVICES | ENTHONE INC. (US) | 2007-07-18 | — | — | EP | claimed |
| WO-2006044990-A1 | COBALT AND NICKEL ELECTROLESS PLATING IN MICROELECTRONIC DEVICES | ENTHONE INC. (US) | 2006-04-27 | — | — | WO | claimed |
| US-20060083850-A1 | Cobalt and nickel electroless plating in microelectronic devices | ENTHONE INC. (US) | 2006-04-20 | — | — | US | claimed |
| US-4358426-A | SOLVENT EXTRACTION OF URANIUM, PLUTONIUM OR ZIRCONIUM COMPOUND WITH AQUEOUS SOLUTION OF HYDRAZINE SALT | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES DEPARTMENT OF ENERGY (US) | 1982-11-09 | — | — | US | claimed |
| US-4091172-A | SILVER FILM DEPOSITED OVER GOLD FILM BY ELECTROLESS DEPOSITION | PPG INDUSTRIES, INC. (US) | 1978-05-23 | — | — | US | claimed |
| US-4005229-A | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures | PPG INDUSTRIES, INC. (US) | 1977-01-25 | — | — | US | claimed |
| JP-4311583-A | — | — | None | — | — | JP | disclosed |
| CN-119569535-A | Production process and production system of hexafluoroisopropanol | 中化蓝天氟材料有限公司 | 2025-03-07 | — | — | CN | disclosed |
| US-11469006-B2 | Suppression of radionuclide deposition on nuclear power plant components | DOMINION ENGINEERING, INC. (US) | 2022-10-11 | — | — | US | disclosed |
| EP-2979781-B1 | CONDUCTIVE PARTICLES, METHOD OF MANUFACTURING THE SAME, CONDUCTIVE RESIN COMPOSITION CONTAINING SAME, AND CONDUCTIVE COATED OBJECT | TOYO ALUMINIUM KK (JP) | 2022-02-16 | — | — | EP | disclosed |
| EP-3494090-A2 | SUPPRESSION OF RADIONUCLIDE DEPOSITION ON NUCLEAR POWER PLANT COMPONENTS | Dominion Engineering, Inc. (US) | 2019-06-12 | — | — | EP | disclosed |
| US-4695489-A | Electroless nickel plating composition and method | GENERAL ELECTRIC COMPANY (US) | 1987-09-22 | — | — | US | disclosed |
| EP-0228845-A2 | N-containing heterocyclic compounds, processes for the preparation thereof and composition comprising the same | FUJISAWA PHARMACEUTICAL CO., LTD. (JP) | 1987-07-15 | — | — | EP | disclosed |
| US-4358426-A | SOLVENT EXTRACTION OF URANIUM, PLUTONIUM OR ZIRCONIUM COMPOUND WITH AQUEOUS SOLUTION OF HYDRAZINE SALT | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES DEPARTMENT OF ENERGY (US) | 1982-11-09 | — | — | US | disclosed |
| US-4091172-A | SILVER FILM DEPOSITED OVER GOLD FILM BY ELECTROLESS DEPOSITION | PPG INDUSTRIES, INC. (US) | 1978-05-23 | — | — | US | disclosed |
| US-4091128-A | Electroless gold plating bath | PPG INDUSTRIES, INC. (US) | 1978-05-23 | — | — | US | disclosed |
| US-4005229-A | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures | PPG INDUSTRIES, INC. (US) | 1977-01-25 | — | — | US | disclosed |