⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28053455 | 0.79 | — | — | |
| SCHEMBL6165452 | 0.63 | — | — | |
| SCHEMBL2295963 | 0.60 | — | — | |
| SCHEMBL6559802 | 0.45 | — | — | |
| Charcoal, Activated SCHEMBL3432143 | 0.45 | — | — | |
| SCHEMBL23235911 | 0.45 | — | — | |
| SCHEMBL3392733 | 0.45 | — | — | |
| SCHEMBL1285 | 0.45 | — | — | |
| SCHEMBL1461498 | 0.45 | — | — | |
| SCHEMBL10364713 | 0.45 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8003712-B2 | Resin composition and process for producing resin molding | SONY CORPORATION (JP) | 2011-08-23 | — | — | US | disclosed |
| EP-2256166-A1 | Resin composition and process for producing resin molding | Sony Corporation (JP) | 2010-12-01 | — | — | EP | disclosed |
| US-20100144936-A1 | RESIN COMPOSITION AND PROCESS FOR PRODUCING RESIN MOLDING | SONY CORPORATION (JP) | 2010-06-10 | — | — | US | disclosed |
| US-7691928-B2 | Resin composition and process for producing resin molding | SONY CORPORATION (JP) | 2010-04-06 | — | — | US | disclosed |
| US-7671117-B2 | Resin composition | SONY CORPORATION (JP) | 2010-03-02 | — | — | US | disclosed |
| US-20090005475-A1 | RESIN COMPOSITION | SONY CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| EP-1990365-A1 | Resin composition | Sony Corporation (JP) | 2008-11-12 | — | — | EP | disclosed |
| US-20060167134-A1 | Resin composition and process for producing resin molding | Lerner, David, Littenberg, Krumholz & Mentlik, LLP | 2006-07-27 | — | — | US | disclosed |
| EP-1591487-A1 | RESIN COMPOSITION AND PROCESS FOR PRODUCING RESIN MOLDING | Sony Corporation (JP) | 2005-11-02 | — | — | EP | disclosed |
| EP-1538184-A1 | RESIN COMPOSITION | Sony Corporation (JP) | 2005-06-08 | — | — | EP | disclosed |
| US-20050014870-A1 | Resin composition | SONY CORPORATION (JP) | 2005-01-20 | — | — | US | disclosed |
| US-RE31522-E | COPOLYMERS OF DIAMINE-ENDCAPPED POLYOXYETHYLENE GLYCOLS AND A DICARBOXYLIC ACID; HYDRAULIC FLUIDS; METAL WORKING | CINCINNATI MILACRON INC. (US) | 1984-02-14 | — | — | US | disclosed |
| US-4374741-A | LUBRICANTS, METAL WORKING, POLYETHER BLOCK POLYMERJ | CINCINNATI MILACRON INC. (US) | 1983-02-22 | — | — | US | disclosed |