Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Bicarbonate. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC4 | P56524 | 2/20 | 0.42 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.42 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.42 |
| ▸ | HDAC6 | Q9UBN7 | 2/20 | 0.42 |
| ▸ | CTSK | P43235 | 1/20 | 0.38 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.37 |
| ▸ | ACMSD | Q8TDX5 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | RAB9A | P51151 | 2/20 | 0.35 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.34 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.34 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.34 |
| ▸ | HDAC5 | Q9UQL6 | 1/20 | 0.34 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.34 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.33 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.33 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 2/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bicarbonate SCHEMBL8758237 | 1.00 | HDAC4 (0.42) | HDAC4HDAC2HDAC8HDAC6CTSK | |
| Acetic Acid SCHEMBL28119349 | 0.93 | HDAC4 (0.41) | HDAC4HDAC2HDAC8HDAC6CTSK | |
| Hydrogen Peroxide SCHEMBL9155269 | 0.93 | — | — | |
| Bicarbonate SCHEMBL9412268 | 0.90 | HDAC4 (0.36) | HDAC4HDAC2HDAC8HDAC6CTSK | |
| Bicarbonate SCHEMBL5451359 | 0.90 | HDAC4 (0.36) | HDAC4HDAC2HDAC8HDAC6CTSK | |
| Methyl Alcohol SCHEMBL8591271 | 0.87 | — | — | |
| SCHEMBL3682136 | 0.87 | HDAC4 (0.37) | HDAC4HDAC2HDAC8HDAC6CTSK | |
| SCHEMBL3959 | 0.87 | — | — | |
| SCHEMBL7060749 | 0.87 | HDAC4 (0.37) | HDAC4HDAC2HDAC8HDAC6CTSK | |
| SCHEMBL3297566 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10293573-B2 | Micro flow channel chip and method for producing flow channel chip | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2019-05-21 | — | — | US | disclosed |
| US-20170354971-A1 | FLOW CHANNEL DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2017-12-14 | — | — | US | disclosed |
| US-20170203537-A1 | MICRO FLOW CHANNEL CHIP AND METHOD FOR PRODUCING FLOW CHANNEL CHIP | SUMITOMO BAKELITE CO., LTD. (JP) | 2017-07-20 | — | — | US | disclosed |
| US-9399725-B2 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-07-26 | — | — | US | disclosed |
| US-9051452-B2 | Polymer compositions for temporary bonding | PROMERUS, LLC (US) | 2015-06-09 | — | — | US | disclosed |
| EP-2351804-B1 | USE OF A RESIN COMPOSITION AS A TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME | SUMITOMO BAKELITE CO (JP) | 2014-12-10 | — | — | EP | disclosed |
| US-8889524-B2 | Substrate treating method, stack and semiconductor device | JSR CORPORATION (JP) | 2014-11-18 | — | — | US | disclosed |
| US-8633259-B2 | Polymer compositions for temporary bonding | PROMERUS, LLC (US) | 2014-01-21 | — | — | US | disclosed |
| US-20130299946-A1 | SUBSTRATE TREATING METHOD, STACK AND SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2013-11-14 | — | — | US | disclosed |
| EP-2551924-A1 | METHOD OF MANUFACTURE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING ELEMENT MANUFACTURED THEREBY | Sumitomo Bakelite Company Limited (JP) | 2013-01-30 | — | — | EP | disclosed |
| EP-2506298-A1 | PRODUCTION METHOD FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, PRODUCTION METHOD FOR ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE PACKAGE | Sumitomo Bakelite Company Limited (JP) | 2012-10-03 | — | — | EP | disclosed |
| US-20120228782-A1 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE | Sumitomo Bakelite Co, Ltd (JP) | 2012-09-13 | — | — | US | disclosed |
| WO-2012092447-A1 | POLYMER COMPOSITIONS FOR TEMPORARY BONDING | PROMERUS, LLC (US) | 2012-07-05 | — | — | WO | disclosed |
| US-20120172479-A1 | POLYMER COMPOSITIONS FOR TEMPORARY BONDING | PROMERUS LLC (US) | 2012-07-05 | — | — | US | disclosed |
| US-20110318938-A1 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-12-29 | — | — | US | disclosed |
| US-20110263095-A1 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-10-27 | — | — | US | disclosed |
| EP-2351804-A1 | TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME | Sumitomo Bakelite Company Limited (JP) | 2011-08-03 | — | — | EP | disclosed |
| EP-2351805-A1 | TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME | Sumitomo Bakelite Company Limited (JP) | 2011-08-03 | — | — | EP | disclosed |
| EP-2264112-A2 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive | Sumitomo Bakelite Co., Ltd. (JP) | 2010-12-22 | — | — | EP | disclosed |
| EP-2264113-A2 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive | Sumitomo Bakelite Co., Ltd. (JP) | 2010-12-22 | — | — | EP | disclosed |