SCHEMBL2302193

SCHEMBL2302193

[Co].[Cu].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28494456 1.00
SCHEMBL11676365 1.00
SCHEMBL16583531 1.00
SCHEMBL31145834 1.00
SCHEMBL11878122 0.87
SCHEMBL16266343 0.87
SCHEMBL6259907 0.87
SCHEMBL3904634 0.87
SCHEMBL15553919 0.87
SCHEMBL8135410 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1057 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4023783-B1 METHOD FOR MANUFACTURING CONTINUOUS CASTING MOLD JFE STEEL CORP (JP) 2026-02-18 EP claimed
CN-120192582-A Aerogel with radio frequency dielectric near-zero performance and preparation method and application thereof 山东第一医科大学(山东省医学科学院) 2025-06-24 CN claimed
CN-120006330-A Ultrathin nickel cobalt copper nanobelt, preparation method thereof and application thereof in electrocatalytic reaction 东莞理工学院 2025-05-16 CN claimed
CN-119876603-A Method for leaching nickel-cobalt copper sulfide under near neutral pH condition 中南大学 2025-04-25 CN claimed
CN-119824253-A Method for smelting deep sea polymetallic nodule by directly reducing matte by using desulfurized gypsum 沈阳有色金属研究院有限公司 2025-04-15 CN claimed
CN-118291809-B High-conductivity high-heat-dissipation copper-cobalt-nickel-silicon alloy strip foil and preparation method thereof 宁波兴业盛泰集团有限公司 2025-02-25 CN claimed
CN-119368547-A Method for treating copper-cobalt-nickel-containing spent catalyst and homogenizing device thereof 渤瑞环保股份有限公司 2025-01-28 CN claimed
WO-2025016200-A1 CHELATING RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND USE THEREOF 上海稀固科技有限公司 2025-01-23 WO claimed
CN-119331129-A Chelate resin composition, preparation method and application thereof 上海稀固科技有限公司 2025-01-21 CN claimed
CN-118507218-B Magnetoelectric adjustable inductor based on passive adjustment mode 北京迪文科技有限公司 2025-01-03 CN claimed
CN-1811617-A Magnetic conducting, thermal resistant metal thin film composite sleeve and producing method and equipment thereof AOWEI INDUSTRY & TRADE CO LTD (CN) 2006-08-02 CN claimed
US-6939622-B2 Chip-on-film use copper foil FURUKAWA CIRCUIT FOIL CO., LTD (JP) 2005-09-06 US claimed
US-20040170857-A1 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield THE FURUKAWA ELECTRIC CO., LTD. (JP) 2004-09-02 US claimed
EP-1452627-A2 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield FURUKAWA CIRCUIT FOIL CO., LTD. (JP) 2004-09-01 EP claimed
CN-1525492-A Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield �źӵ�·ͭ����ʽ���� 2004-09-01 CN claimed
CN-1523951-A Chip-on-film use copper foil 古河电路铜箔株式会社 2004-08-25 CN claimed
US-20040161627-A1 Chip-on-film use copper foil FURUKAWA CIRCUIT FOIL CO., LTD. (JP) 2004-08-19 US claimed
EP-1448035-A1 Chip-on-film use copper foil FURUKAWA CIRCUIT FOIL CO., LTD. (JP) 2004-08-18 EP claimed
CN-1058056-C Process of chlorine complexing oxidation method for slective leaching nickel cobalt copper sulfurized ore CN ACAD INST CHEM METALLURGY (CN) 2000-11-01 CN claimed
CN-1206747-A Process of chlorine complexing oxidation method for slective leaching nickel cobalt copper sulfurized ore CHEMICAL METALLURGY INST CAS (CN) 1999-02-03 CN claimed