⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL119767 | 0.91 | — | — | |
| SCHEMBL1079011 | 0.91 | — | — | |
| SCHEMBL19181889 | 0.86 | — | — | |
| SCHEMBL3750354 | 0.86 | — | — | |
| SCHEMBL3417337 | 0.82 | — | — | |
| SCHEMBL4630694 | 0.82 | — | — | |
| Bromomethane SCHEMBL8205920 | 0.78 | — | — | |
| Methylamine SCHEMBL16268669 | 0.78 | — | — | |
| Methylamine SCHEMBL28161225 | 0.75 | — | — | |
| SCHEMBL250607 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2350340-A1 | SYSTEMS, APPARATUS AND METHODS FOR COATING THE INTERIOR OF A CONTAINER USING A PHOTOLYSIS AND/OR THERMAL CHEMICAL VAPOR DEPOSITION PROCESS | Becton, Dickinson and Company (US) | 2011-08-03 | — | — | EP | claimed |
| WO-2010034004-A1 | SYSTEMS, APPARATUS AND METHODS FOR COATING THE INTERIOR OF A CONTAINER USING A PHOTOLYSIS AND/OR THERMAL CHEMICAL VAPOR DEPOSITION PROCESS | BECTON, DICKINSON AND COMPANY (US) | 2010-03-25 | — | — | WO | claimed |
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | claimed |
| US-20240429393-A1 | CATHODE COMPRISING AN ELECTRONICALLY CONDUCTIVE REDOX POLYMER, AND METHOD TO PRODUCE SUCH A CATHODE | BELENOS CLEAN POWER HOLDING AG (CH) | 2024-12-26 | — | — | US | disclosed |
| EP-4481839-A1 | CATHODE COMPRISING AN ELECTRONICALLY CONDUCTIVE REDOX POLYMER, AND METHOD TO PRODUCE SUCH A CATHODE | Belenos Clean Power Holding AG (CH) | 2024-12-25 | — | — | EP | disclosed |
| CN-117396811-A | Composition for forming underlayer film of silicon-containing resist | 日产化学株式会社 | 2024-01-12 | — | — | CN | disclosed |
| EP-3894583-A1 | AMPLIFICATION METHODS AND SYSTEMS FOR MERFISH AND OTHER APPLICATIONS | President and Fellows of Harvard College (US) | 2021-10-20 | — | — | EP | disclosed |
| WO-2020123742-A1 | AMPLIFICATION METHODS AND SYSTEMS FOR MERFISH AND OTHER APPLICATIONS | PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) | 2020-06-18 | — | — | WO | disclosed |
| WO-2018141832-A1 | TRANSPARENT SCRATCH-RESISTANT LAYER HAVING ANTI-FOULING PROPERTIES AND METHOD FOR PRODUCING SAME | FACHHOCHSCHULE KIEL (DE) | 2018-08-09 | — | — | WO | disclosed |
| EP-1037511-B1 | Surface treatment of copper to prevent microcracking in flexible circuits | JX NIPPON MINING & METALS CORP (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-20060083469-A1 | Means and method for coupling optical components | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2006-04-20 | — | — | US | disclosed |
| EP-1114734-A1 | RESIN COMPOSITION FOR INK-JET RECORDING SHEET AND RECORDING SHEET MADE WITH THE SAME | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2001-07-11 | — | — | EP | disclosed |
| US-6221176-B1 | PROVIDING COPPER LAYER; TREATING COPPER LAYER TO PREVENT MICROCRACKING; AFFIXING FIRST SIDE OF COPPER LAYER TO FIRST FLEXIBLE POLYMERIC FILM; PATTERNING COPPER LAYER; AFFIXING SECOND FLEXIBLE POLYMERIC FILM TO SECOND SIDE OF COPPER LAYER | GOULD ELECTRONICS, INC. | 2001-04-24 | — | — | US | disclosed |
| EP-1037511-A2 | Surface treatment of copper to prevent microcracking in flexible circuits | GA-TEK Inc. (US) | 2000-09-20 | — | — | EP | disclosed |
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | disclosed |
| US-5622782-A | USEFUL IN MANUFACTURE OF PRINTED CIRCUIT BOARDS | GOULD INC. (US) | 1997-04-22 | — | — | US | disclosed |
| EP-0637902-A1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC. (US) | 1995-02-08 | — | — | EP | disclosed |