SCHEMBL2306980

SCHEMBL2306980

COC(CO)COOCC(CO)OC

nearest known ligand 0.48

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.48
CYP2C9 P11712 1/20 0.48
PRKCA P17252 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13136906 0.89
SCHEMBL14007344 0.85
SCHEMBL6041979 0.85
SCHEMBL5719 0.85
SCHEMBL3483503 0.82 TSHR (0.48) TSHRCYP2C9PRKCA
SCHEMBL360480 0.81
SCHEMBL19067467 0.80 CYP2C9 (0.47) TSHRCYP2C9PRKCA
SCHEMBL2237300 0.79 LPAR1 (0.46) PRKCA
SCHEMBL12767501 0.78
Hydrochloric Acid SCHEMBL20746533 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109219651-B Liquid detergent composition for fiber products 花王株式会社 2021-10-12 CN claimed
US-20250066693-A1 COMPOSITION KAO CORPORATION (JP) 2025-02-27 US disclosed
US-20250051696-A1 DETERGENT COMPOSITION KAO CORPORATION (JP) 2025-02-13 US disclosed
EP-4455257-A1 CLEANING AGENT COMPOSITION Kao Corporation (JP) 2024-10-30 EP disclosed
EP-4454715-A1 COMPOSITION Kao Corporation (JP) 2024-10-30 EP disclosed
US-20240060004-A1 DETERGENT COMPOSITION FOR FIBERS KAO CORPORATION (JP) 2024-02-22 US disclosed
US-20240052261-A1 DETERGENT COMPOSITION FOR FIBERS KAO CORPORATION (JP) 2024-02-15 US disclosed
EP-4269680-A1 DETERGENT COMPOSITION FOR TEXTILES Kao Corporation (JP) 2023-11-01 EP disclosed
EP-4269547-A1 DETERGENT COMPOSITION FOR FIBERS Kao Corporation (JP) 2023-11-01 EP disclosed
WO-2023153339-A1 LIQUID CLEANING AGENT COMPOSITION 花王株式会社 2023-08-17 WO disclosed
US-8217115-B2 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package SUMITOMO BAKELITE COMPANY, LTD (JP) 2012-07-10 US disclosed
CN-101536172-B Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, package and method for manufacturing the same SUMITOMO BAKELITE CO 2012-05-30 CN disclosed
US-20110224126-A1 LIQUID DETERGENT COMPOSITION KAO CORPORATION (JP) 2011-09-15 US disclosed
EP-2351823-A1 LIQUID DETERGENT COMPOSITION Kao Corporation (JP) 2011-08-03 EP disclosed
US-20100006998-A1 LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER HAVING ADHESIVE LAYER, SEMICONDUCTOR ELEMENT HAVING ADHESIVE LAYER, SEMICONDUCTOR PACKAGE, PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT AND PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-14 US disclosed
CN-101536172-A Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, method for manufacturing semiconductor element, and method for manu SUMITOMO BAKELITE CO (JP) 2009-09-16 CN disclosed
CN-100414038-C Fiber product treating agent composition KAO CORP (JP) 2008-08-27 CN disclosed
CN-1829838-A Fiber product treating agent composition KAO CORP (JP) 2006-09-06 CN disclosed
CN-1145834-C Panel for liquid crystal display and manufacturing method thereof �Ҵ���˾ 2004-04-14 CN disclosed
CN-1330283-A Panel for liquid crystal display and manufacturing method thereof IBM (US) 2002-01-09 CN disclosed