⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1799712 | 0.85 | — | — | |
| SCHEMBL29040365 | 0.82 | — | — | |
| SCHEMBL2906007 | 0.78 | — | — | |
| SCHEMBL6899030 | 0.78 | — | — | |
| SCHEMBL28404211 | 0.76 | — | — | |
| SCHEMBL28694383 | 0.76 | — | — | |
| SCHEMBL2049611 | 0.75 | — | — | |
| SCHEMBL28155668 | 0.72 | — | — | |
| SCHEMBL29264288 | 0.70 | — | — | |
| SCHEMBL28599257 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021043051-A1 | HIGH-PERFORMANCE HEAT CONDUCTING INTERFACE MATERIAL AND APPLICATION THEREOF | 上海阿莱德实业股份有限公司 | 2021-03-11 | — | — | WO | disclosed |
| WO-2021043052-A1 | METHOD FOR PREPARING THERMALLY CONDUCTIVE INTERFACE MATERIAL | 上海阿莱德实业股份有限公司 | 2021-03-11 | — | — | WO | disclosed |