SCHEMBL2308779

SCHEMBL2308779

C=CCNC(=O)C(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL787343 0.84
Hydrochloric Acid SCHEMBL27749339 0.82 HPGD (0.46)
SCHEMBL27958358 0.81
SCHEMBL14521227 0.81 MAPT (0.48)
SCHEMBL6890429 0.81 MAPT (0.48)
SCHEMBL107767 0.81 MAPT (0.48)
SCHEMBL15627332 0.81 SMN1; SMN2 (0.48)
SCHEMBL4347265 0.81 MAPT (0.48)
SCHEMBL12344727 0.80
SCHEMBL19198544 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4363511-A1 ELECTRODEPOSITABLE COATING COMPOSITIONS PPG Industries Ohio Inc. (US) 2024-05-08 EP claimed
EP-3580290-B1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG IND OHIO INC (US) 2024-05-01 EP claimed
US-11952514-B2 Low-temperature curing adhesive compositions PPG INDUSTRIES OHIO, INC. (US) 2024-04-09 US claimed
CN-117715991-A Electrodepositable coating composition PPG工业俄亥俄公司 2024-03-15 CN claimed
CN-109862873-B Suspension composition 爱客多有限公司 2024-03-08 CN claimed
WO-2023279087-A1 ELECTRODEPOSITABLE COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2023-01-05 WO claimed
CN-110249013-B Low temperature curing coating composition PPG工业俄亥俄公司 2022-08-30 CN claimed
CN-110300770-B Low temperature curing adhesive composition PPG工业俄亥俄公司 2022-03-01 CN claimed
EP-3580253-B1 LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS PPG IND OHIO INC (US) 2021-04-07 EP claimed
CN-110300770-A Low-temperature setting adhesive composition PPG工业俄亥俄公司 2019-10-01 CN claimed
CN-110249013-A low temperature curing coating composition PPG工业俄亥俄公司 2019-09-17 CN claimed
WO-2018148306-A1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2018-08-16 WO claimed
WO-2018148323-A1 LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2018-08-16 WO claimed
EP-2194778-B1 IMPROVEMENTS IN OR RELATING TO ORGANIC COMPOUNDS SYNGENTA LTD (GB) 2017-01-18 EP claimed
US-20110190129-A1 IMPROVEMENTS IN OR RELATING TO ORGANIC COMPOUNDS SYNGENTA LIMITED (GB) 2011-08-04 US claimed
EP-4363511-A1 ELECTRODEPOSITABLE COATING COMPOSITIONS PPG Industries Ohio Inc. (US) 2024-05-08 EP disclosed
EP-3580290-B1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG IND OHIO INC (US) 2024-05-01 EP disclosed
EP-0723972-A1 Lactylamines and their pharmaceutical application STEPAN EUROPE (FR) 1996-07-31 EP disclosed
US-5362480-A Microbiocides LEVER BROTHERS COMPANY, DIVISION OF CONOPCO, INC. (US) 1994-11-08 US disclosed
EP-0550099-A1 Oral hygiene compositions containing amino sugars as antiplaque agents UNILEVER N.V. (NL) 1993-07-07 EP disclosed