⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL604418 | 1.00 | — | — | |
| SCHEMBL21834894 | 1.00 | — | — | |
| SCHEMBL28510299 | 0.93 | — | — | |
| SCHEMBL27285528 | 0.93 | — | — | |
| Phosphine SCHEMBL27526166 | 0.93 | — | — | |
| SCHEMBL828277 | 0.93 | — | — | |
| SCHEMBL15901571 | 0.93 | — | — | |
| SCHEMBL11160740 | 0.93 | — | — | |
| SCHEMBL10761803 | 0.93 | — | — | |
| SCHEMBL27551944 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240332169-A1 | BARRIER-FREE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-10-03 | — | — | US | disclosed |
| US-12009293-B2 | Barrier-free interconnect structure and manufacturing method thereof | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-06-11 | — | — | US | disclosed |
| US-20230159424-A1 | Hydroformylation Catalysts Comprising Fluorophosphine Ligands and Precursors Thereof | EXXONMOBIL CHEMICAL PATENTS INC (US) | 2023-05-25 | — | — | US | disclosed |
| EP-4126354-A1 | HYDROFORMYLATION CATALYSTS COMPRISING FLUOROPHOSPHINE LIGANDS AND PRECURSORS THEREOF | ExxonMobil Chemical Patents Inc. (US) | 2023-02-08 | — | — | EP | disclosed |
| US-20220199523-A1 | BARRIER-FREE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-06-23 | — | — | US | disclosed |
| US-11276637-B2 | Barrier-free interconnect structure and manufacturing method thereof | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-03-15 | — | — | US | disclosed |
| WO-2021202225-A1 | HYDROFORMYLATION CATALYSTS COMPRISING FLUOROPHOSPHINE LIGANDS AND PRECURSORS THEREOF | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2021-10-07 | — | — | WO | disclosed |
| US-20210082803-A1 | Barrier-Free Interconnect Structure and Manufacturing Method Thereof | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2021-03-18 | — | — | US | disclosed |