SCHEMBL2315993

SCHEMBL2315993

[Cu+].[NH2-]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9327805 0.71
SCHEMBL30294198 0.71
SCHEMBL8028679 0.71
SCHEMBL6571832 0.71
SCHEMBL29522309 0.71
SCHEMBL29354344 0.71
SCHEMBL4783681 0.50
SCHEMBL277750 0.50
SCHEMBL2004517 0.50
Hydrochloric Acid SCHEMBL37689 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1661160-A4 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES ADVANCED TECH MATERIALS (US) 2008-07-02 EP claimed
US-7294528-B2 Supercritical fluid-assisted deposition of materials on semiconductor substrates ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2007-11-13 US claimed
US-7119418-B2 Supercritical fluid-assisted deposition of materials on semiconductor substrates ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2006-10-10 US claimed
US-20060178006-A1 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES XU CHONGYING 2006-08-10 US claimed
EP-1661160-A2 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES Advanced Technology Materials, Inc. (US) 2006-05-31 EP claimed
US-7030168-B2 Supercritical fluid-assisted deposition of materials on semiconductor substrates ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2006-04-18 US claimed
US-20050181613-A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates ADVANCED TECHNOLOGY MATERIALS, INC. 2005-08-18 US claimed
WO-2005013331-A2 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2005-02-10 WO claimed
US-20040023453-A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates ATMI, INC. 2004-02-05 US claimed
WO-2003058680-A2 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2003-07-17 WO claimed
US-20030124785-A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates ATMI, INC. 2003-07-03 US claimed
US-8562743-B2 Method and apparatus for atomic layer deposition TOKYO ELECTRON LIMITED (JP) 2013-10-22 US disclosed
EP-2060577-B1 Copper precursors for thin film deposition AIR PROD & CHEM (US) 2013-08-21 EP disclosed
US-8263795-B2 Copper precursors for thin film deposition AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-09-11 US disclosed
US-20110203523-A1 METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION TOKYO ELECTRON LIMITED (JP) 2011-08-25 US disclosed
US-20050181613-A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates ADVANCED TECHNOLOGY MATERIALS, INC. 2005-08-18 US disclosed
WO-2005013331-A2 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2005-02-10 WO disclosed
US-20040023453-A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates ATMI, INC. 2004-02-05 US disclosed
WO-2003058680-A2 SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2003-07-17 WO disclosed
US-20030124785-A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates ATMI, INC. 2003-07-03 US disclosed