SCHEMBL23175182

SCHEMBL23175182

[SiH3]CCOCC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4811191 0.89 TSHR (0.72)
SCHEMBL177652 0.86
SCHEMBL8679483 0.84 TSHR (0.78)
SCHEMBL20094 0.84 TSHR (0.79)
SCHEMBL22418810 0.84 TSHR (0.79)
SCHEMBL17197994 0.84 TSHR (0.79)
SCHEMBL29057208 0.82 TSHR (0.75)
SCHEMBL27920157 0.82 TSHR (0.75)
SCHEMBL5954248 0.81 TSHR (0.75)
SCHEMBL1005362 0.81 TSHR (0.75)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113004511-B Stable modified polymer polyol dispersions 雷普索尔有限公司 2024-10-01 CN disclosed
CN-114466912-B Primer composition for glass adhesives 株式会社KCC 2023-10-13 CN disclosed
CN-112724924-B Silicone structural adhesive for hollow glass and preparation method thereof 广州市白云化工实业有限公司 2022-07-29 CN disclosed
CN-112888657-B Ketone-based solvent-dispersed silica sol and resin composition 日产化学株式会社 2022-05-03 CN disclosed
CN-113474730-A Negative photosensitive resin composition, method for producing cured film using same, and touch panel 东丽株式会社 2021-10-01 CN disclosed
CN-106662820-B Composition for forming silicon-containing resist underlayer film having halosulfonylalkyl group 日产化学工业株式会社 2021-06-22 CN disclosed
CN-112888657-A Ketone-based solvent-dispersed silica sol and resin composition 日产化学株式会社 2021-06-01 CN disclosed
CN-104854509-B Coating liquid for forming inorganic oxide coating film, and display device 日产化学工业株式会社 2021-04-13 CN disclosed
WO-2021066369-A1 PRIMER COMPOSITION FOR GLASS ADHESIVE 주식회사 케이씨씨 2021-04-08 WO disclosed