⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL1894154 | 0.66 | — | — | |
| SCHEMBL18487484 | 0.65 | — | — | |
| SCHEMBL10778374 | 0.65 | — | — | |
| SCHEMBL18983005 | 0.65 | — | — | |
| SCHEMBL20332601 | 0.65 | — | — | |
| SCHEMBL18622138 | 0.65 | — | — | |
| SCHEMBL7353958 | 0.65 | — | — | |
| SCHEMBL23861766 | 0.63 | — | — | |
| SCHEMBL8056811 | 0.63 | — | — | |
| SCHEMBL8245978 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024144027-A1 | HIGH-REFRACTIVE-INDEX AND HIGH-ADHESION EPOXY RESIN COMPOSITION AND ENCAPSULANT COMPRISING SAME | 솔루스첨단소재 주식회사 | 2024-07-04 | — | — | WO | claimed |
| US-20240240013-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME | LG CHEM, LTD. (KR) | 2024-07-18 | — | — | US | disclosed |
| WO-2024144027-A1 | HIGH-REFRACTIVE-INDEX AND HIGH-ADHESION EPOXY RESIN COMPOSITION AND ENCAPSULANT COMPRISING SAME | 솔루스첨단소재 주식회사 | 2024-07-04 | — | — | WO | disclosed |
| EP-4180487-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED PRODUCT COMPRISING SAME | LG CHEM, LTD. (KR) | 2023-05-17 | — | — | EP | disclosed |
| CN-116096813-A | Thermoplastic resin composition, method of preparing the same, and molded article comprising the same | 株式会社LG化学 | 2023-05-09 | — | — | CN | disclosed |
| CN-112088324-B | Polarizing plate, method for manufacturing the same, and image display device including the same | 杉金光电(苏州)有限公司 | 2022-07-19 | — | — | CN | disclosed |
| CN-109072547-B | Textile electrophotographic printing | 惠普印迪戈股份公司 | 2022-06-14 | — | — | CN | disclosed |
| CN-109074012-B | Label (R) | 惠普印迪戈股份公司 | 2022-04-08 | — | — | CN | disclosed |
| US-11143977-B2 | Labels | HP INDIGO B.V. (NL) | 2021-10-12 | — | — | US | disclosed |
| US-20210240017-A1 | POLARIZING PLATE, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE COMPRISING SAME | SHANJIN OPTOELECTRONICS (SUZHOU) CO., LTD. (CN) | 2021-08-05 | — | — | US | disclosed |
| US-20190048523-A1 | TEXTILE PRINTING | HEWLETT-PACKARD INDIGO B.V. (NL) | 2019-02-14 | — | — | US | disclosed |
| EP-3414390-A1 | TEXTILE ELECTROPHOTOGRAPHIC PRINTING | HP Indigo B.V. (NL) | 2018-12-19 | — | — | EP | disclosed |
| EP-3414626-A1 | LABELS | HP Indigo B.V. (NL) | 2018-12-19 | — | — | EP | disclosed |
| EP-1512519-B1 | A method and a system for solid freeform fabrication using non-reactive powder | HEWLETT PACKARD DEVELOPMENT CO (US) | 2011-08-10 | — | — | EP | disclosed |
| US-7255825-B2 | Materials and methods for freeform fabrication of solid three-dimensional objects using fusible, water-containing support materials | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2007-08-14 | — | — | US | disclosed |
| US-7120512-B2 | Method and a system for solid freeform fabricating using non-reactive powder | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2006-10-10 | — | — | US | disclosed |
| US-20050200039-A1 | Materials and methods for freeform fabrication of solid three-dimensional objects using fusible, water-containing support materials | PERIDOT PRINT LLC | 2005-09-15 | — | — | US | disclosed |
| EP-1512519-A2 | A method and a system for solid freeform fabrication using non-reactive powder | Hewlett-Packard Development Company, L.P. (US) | 2005-03-09 | — | — | EP | disclosed |
| US-20050049739-A1 | Method and a system for solid freeform fabrication using non-reactive powder | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2005-03-03 | — | — | US | disclosed |
| US-5087286-A | Hydroxyl-containing resin, amino resin and crosslinkable resin | KANSAI PAINT CO., LTD. (JP) | 1992-02-11 | — | — | US | disclosed |