SCHEMBL23197878

SCHEMBL23197878

Nc1ccc(C(c2ccc(N)c(C(O)(C(F)(F)F)C(F)(F)F)c2)C(F)(F)F)cc1C(O)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.57
ESR1 P03372 1/20 0.42
ESR2 Q92731 1/20 0.42
MEN1 O00255 3/20 0.40
KMT2A Q03164 3/20 0.40
KDM4E B2RXH2 2/20 0.40
MAPT P10636 2/20 0.40
MAPK1 P28482 2/20 0.40
HTT P42858 2/20 0.40
LMNA P02545 1/20 0.40
NPSR1 Q6W5P4 1/20 0.40
HSD17B10 Q99714 2/20 0.36
ALDH1A1 P00352 2/20 0.36
GAA P10253 2/20 0.36
GLA P06280 1/20 0.36
POLB P06746 1/20 0.36
HPGD P15428 1/20 0.36
ATM Q13315 1/20 0.36
FFAR4 Q5NUL3 1/20 0.33
ALOX15 P16050 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30442563 1.00 SMN1; SMN2 (0.57) SMN1; SMN2ESR1ESR2MEN1KMT2A
SCHEMBL26327916 0.83 SMN1; SMN2 (0.42) SMN1; SMN2ESR1ESR2HTTALDH1A1
SCHEMBL23197877 0.83 SMN1; SMN2 (0.62) SMN1; SMN2ESR1ESR2MEN1KMT2A
SCHEMBL22326115 0.82 ESR1 (0.43) SMN1; SMN2ESR1ESR2HTTALDH1A1
SCHEMBL26328085 0.80 SMN1; SMN2 (0.42) SMN1; SMN2MEN1KMT2AKDM4EMAPT
SCHEMBL1635164 0.76 SMN1; SMN2 (0.67) SMN1; SMN2MEN1KMT2AKDM4EMAPT
SCHEMBL23005780 0.76 ESR1 (0.50) SMN1; SMN2ESR1ESR2MEN1KMT2A
SCHEMBL10036532 0.76 SMN1; SMN2 (0.67) SMN1; SMN2ESR2MEN1KMT2AKDM4E
SCHEMBL25210957 0.73 SMN1; SMN2 (0.42) SMN1; SMN2ESR1ESR2MEN1KMT2A
SCHEMBL12352871 0.73 SMN1; SMN2 (1.00) SMN1; SMN2MEN1KMT2AKDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025070154-A1 POLYAMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT 東レ株式会社 2025-04-03 WO disclosed
US-20230287178-A1 Fluorinated Diamine or Salt Thereof, Method for Producing Fluorinated Diamine or Salt Thereof, Polyamide, Method for Producing Polyamide, Polyamide Solution, Cyclized Polyamide, Method for Producing Cyclized Polyamide, Insulation for High-Frequency Electronic Component, Method for Producing Insulation for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Appliance, and Insulating Material for Producing High-Frequency Electronic Component CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-14 US disclosed
US-20230287178-A1 Fluorinated Diamine or Salt Thereof, Method for Producing Fluorinated Diamine or Salt Thereof, Polyamide, Method for Producing Polyamide, Polyamide Solution, Cyclized Polyamide, Method for Producing Cyclized Polyamide, Insulation for High-Frequency Electronic Component, Method for Producing Insulation for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Appliance, and Insulating Material for Producing High-Frequency Electronic Component CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-14 US disclosed
EP-4190768-A1 FLUORINATED DIAMINE OR SALT THEREOF, METHOD FOR PRODUCING FLUORINATED DIAMINE OR SALT THEREOF, POLYAMIDE, METHOD FOR PRODUCING POLYAMIDE, POLYAMIDE SOLUTION, CYCLIZED POLYAMIDE, METHOD FOR PRODUCING CYCLIZED POLYAMIDE, INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY APPLIANCE, AND INSULATING MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT Central Glass Company, Limited (JP) 2023-06-07 EP disclosed
EP-4190768-A1 FLUORINATED DIAMINE OR SALT THEREOF, METHOD FOR PRODUCING FLUORINATED DIAMINE OR SALT THEREOF, POLYAMIDE, METHOD FOR PRODUCING POLYAMIDE, POLYAMIDE SOLUTION, CYCLIZED POLYAMIDE, METHOD FOR PRODUCING CYCLIZED POLYAMIDE, INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY APPLIANCE, AND INSULATING MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT Central Glass Company, Limited (JP) 2023-06-07 EP disclosed
WO-2021065540-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2021-04-08 WO disclosed