SCHEMBL2319985

SCHEMBL2319985

C[CH]CCCCCCCCF

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10589487 1.00
SCHEMBL5187739 1.00
SCHEMBL5186095 0.97
SCHEMBL2516177 0.87
SCHEMBL9668013 0.83 TSHR (0.35)
SCHEMBL18660194 0.83 TSHR (0.35)
SCHEMBL9421489 0.83 TSHR (0.35)
SCHEMBL9421453 0.83 TSHR (0.35)
SCHEMBL7870810 0.83
SCHEMBL9670647 0.83 TSHR (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023002853-A1 ACRYLIC RESIN FOR INK 株式会社日本触媒 2023-01-26 WO disclosed
US-9441065-B2 Curable composition for imprints, cured product and method for manufacturing a cured product FUJIFILM CORPORATION (JP) 2016-09-13 US disclosed
US-8999221-B2 Curable composition for imprints, patterning method and pattern FUJIFILM CORPORATION (JP) 2015-04-07 US disclosed
US-8883065-B2 Curable composition for imprints, patterning method and pattern FUJIFILM CORPORATION (JP) 2014-11-11 US disclosed
US-20140121292-A1 CURABLE COMPOSITION FOR IMPRINTS, PATTERNING METHOD AND PATTERN FUJIFILM CORPORATION (JP) 2014-05-01 US disclosed
US-20110236595-A1 CURABLE COMPOSITION FOR IMPRINTS, PATTERNING METHOD AND PATTERN FUJIFILM CORPORATION (JP) 2011-09-29 US disclosed
EP-2352768-A2 CURABLE COMPOSITION FOR IMPRINTS, PATTERNING METHOD AND PATTERN FUJIFILM Corporation (JP) 2011-08-10 EP disclosed
WO-2010064726-A2 CURABLE COMPOSITION FOR IMPRINTS, PATTERNING METHOD AND PATTERN FUJIFILM CORPORATION (JP) 2010-06-10 WO disclosed