SCHEMBL232106

SCHEMBL232106

C=C[Si](OCC)(OCC)O[Si](C=C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22548 0.88
SCHEMBL27823328 0.88
SCHEMBL13007313 0.87
SCHEMBL21494561 0.87
SCHEMBL1456083 0.87
Hydroxyl Radical SCHEMBL28871487 0.86 TSHR (0.32)
Ethylene SCHEMBL9421815 0.86
SCHEMBL31432764 0.86
SCHEMBL8418496 0.86
SCHEMBL7583255 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 282 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12331164-B2 Curable siloxane resin composition KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2025-06-17 US claimed
WO-2025106343-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-05-22 WO claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
CN-119592056-A Durable light-colored antistatic master batch, fiber and preparation method thereof 东华大学 2025-03-11 CN claimed
US-20240258111-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US claimed
US-20230078587-A1 CURABLE SILOXANE RESIN COMPOSITION KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2023-03-16 US claimed
CN-111565859-B Surface treatment composition and method 富士胶片电子材料美国有限公司 2022-12-30 CN claimed
US-11447642-B2 Methods of using surface treatment compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-09-20 US claimed
US-11174394-B2 Surface treatment compositions and articles containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-11-16 US claimed
US-20210122925-A1 METHODS OF USING SURFACE TREATMENT COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-04-29 US claimed
US-20080076262-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2008-03-27 US claimed
US-7345000-B2 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2008-03-18 US claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077353-A1 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077781-A1 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMTED (JP) 2007-04-05 US claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
EP-0317858-B1 RADIATION CURABLE COATING COMPOSITION BASED ON A SILICA/VINYL-FUNCTIONAL SILANOL DISPERSION HOECHST CELANESE CORPORATION (US) 1992-06-03 EP claimed
EP-0317858-A2 Radiation curable coating composition based on a silica/vinyl-functional silanol dispersion HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
US-4822828-A RADIATION TRANSPARENT, WEAR RESISTANT PROTECTIVE COATING HOECHST CELANESE CORPORATION (US) 1989-04-18 US claimed
US-4654382-A TRIGLYCIDYL ETHER OF TRISPHENOL, POLYFUNCTIONAL EPOXY, AND THE REACTION PRODUCT OF AN AROMATIC, DIAMINE, DIVINYLDIS LOXANE, AND BISMALEIMIDE; CURING THE YOKOHAMA RUBBER CO., LTD. (JP) 1987-03-31 US claimed