SCHEMBL23253

SCHEMBL23253

[BeH2].[Co]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19322494 0.82
SCHEMBL7876600 0.82
SCHEMBL515993 0.82
SCHEMBL21541919 0.82
SCHEMBL21541918 0.82
SCHEMBL27584744 0.82
SCHEMBL7876603 0.82
SCHEMBL2018053 0.71
SCHEMBL5971102 0.71
SCHEMBL11426107 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3565911-A1 PISTON COMPRESSION RINGS OF COPPER-BERYLLIUM ALLOYS Materion Corporation (US) 2019-11-13 EP claimed
US-8487304-B2 High performance compliant wafer test probe INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-07-16 US claimed
US-20110266539-A1 High Performance Compliant Wafer Test Probe INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-11-03 US claimed
US-4551187-A Copper alloy BRUSH WELLMAN INC. (US) 1985-11-05 US claimed
JP-7240199-A None JP disclosed
CN-120556100-A Comprehensive treatment device for acid etching waste liquid 深圳市京中康科技有限公司 2025-08-29 CN disclosed
CN-115374612-A Method for calculating assembly interference magnitude of copper alloy casting roller sleeve 酒泉钢铁(集团)有限责任公司 2022-11-22 CN disclosed
CN-112992425-B Preparation method of copper-based composite electric contact material with gradient structure 烟台万隆真空冶金股份有限公司 2022-08-30 CN disclosed
EP-3514123-B1 METHOD FOR MAKING A SUPERABRASIVE COMPACT DIAMOND INNOVATIONS INC (US) 2021-11-03 EP disclosed
CN-112992425-A Preparation method of copper-based composite electric contact material with gradient structure 烟台万隆真空冶金股份有限公司 2021-06-18 CN disclosed
CN-106025064-B Magnetic material and method for producing the same 国际商业机器公司 2020-02-21 CN disclosed
US-10556832-B2 Cutters comprising polycrystalline diamond attached to a hard metal carbide substrate DIAMOND INNOVATIONS, INC. (US) 2020-02-11 US disclosed
JP-H07240199-A MANUFACTURE OF ELECTRODE PLATE FOR BATTERY AND CYLINDRICAL BATTERY USING THIS ELECTRODE PLATE MATSUSHITA ELECTRIC IND CO LTD 1995-09-12 JP disclosed
CN-1010416-B High cavitation erosion resistance aluminum-silicon bronze alloy NO 725 LAB OF SEVENTH RESEARCH (CN) 1990-11-14 CN disclosed
US-4947019-A Composite electrode for resistance welding NIPPONDENSO CO., LTD (JP) 1990-08-07 US disclosed
CN-1041007-A ALUMINIUM-SILICON BRONZE ALLOY WITH HIGH RESISTANCE TO VACUOLUS DENUDATION NO 725 LAB OF SEVENTH RESEARCH (CN) 1990-04-04 CN disclosed
US-4724013-A SOLUTION ANNEALING, COLD WORKING BRUSH WELLMAN, INC. (US) 1988-02-09 US disclosed
US-4551187-A Copper alloy BRUSH WELLMAN INC. (US) 1985-11-05 US disclosed
US-4306907-A Age hardened beryllium alloy and cermets CHARLES STARK DRAPER LABORATORY, INC. (US) 1981-12-22 US disclosed
US-4306907-A Age hardened beryllium alloy and cermets CHARLES STARK DRAPER LABORATORY, INC. (US) 1981-12-22 US disclosed