⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL132178 | 0.91 | — | — | |
| SCHEMBL453457 | 0.73 | — | — | |
| SCHEMBL6227321 | 0.67 | — | — | |
| SCHEMBL4200659 | 0.62 | — | — | |
| SCHEMBL8404066 | 0.61 | — | — | |
| SCHEMBL10799457 | 0.61 | — | — | |
| SCHEMBL16175 | 0.61 | — | — | |
| SCHEMBL9705842 | 0.61 | — | — | |
| SCHEMBL9219479 | 0.61 | — | — | |
| Charcoal, Activated SCHEMBL9844168 | 0.55 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11879052-B2 | Curatives | HEXCEL COMPOSITES LIMITED (GB) | 2024-01-23 | — | — | US | disclosed |
| US-11702516-B2 | Curative composition and a resin composition containing the curative composition | HEXCEL COMPOSITES LIMITED (GB) | 2023-07-18 | — | — | US | disclosed |
| US-20230167272-A1 | IMPROVEMENTS IN OR RELATING TO CURATIVES | HEXCEL COMPOSITES LIMITED (GB) | 2023-06-01 | — | — | US | disclosed |
| US-20200385536-A1 | A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION | HEXCEL COMPOSITES LIMITED (GB) | 2020-12-10 | — | — | US | disclosed |
| WO-2020216688-A1 | IMPROVEMENTS IN OR RELATING TO CURATIVES | HEXCEL COMPOSITES LIMITED (GB) | 2020-10-29 | — | — | WO | disclosed |
| EP-3728414-A1 | A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION | Hexcel Composites Limited (GB) | 2020-10-28 | — | — | EP | disclosed |
| CN-111511809-A | Curing agent composition and resin composition containing same | 赫克塞尔合成有限公司 | 2020-08-07 | — | — | CN | disclosed |
| US-10123412-B2 | Thermosetting polymer formulations, circuit materials, and methods of use thereof | ROGERS CORPORATION (US) | 2018-11-06 | — | — | US | disclosed |
| US-9790400-B2 | Organic-inorganic complex, and forming composition thereof | NIPPON SODA CO., LTD. (JP) | 2017-10-17 | — | — | US | disclosed |
| WO-2017132310-A1 | THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF | ROGERS CORPORATION (US) | 2017-08-03 | — | — | WO | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |
| US-20090093599-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 2009-04-09 | — | — | US | disclosed |
| US-7495060-B2 | Tetrakisphenol and non-clathrated curing agent for epoxy resin | NIPPON SODA CO., LTD. (JP) | 2009-02-24 | — | — | US | disclosed |
| US-20060287465-A1 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | NIPPON SODA CO., LTD (JP) | 2006-12-21 | — | — | US | disclosed |
| EP-1520867-A2 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | NIPPON SODA CO., LTD. (JP) | 2005-04-06 | — | — | EP | disclosed |
| EP-0949286-B1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO (JP) | 2005-03-02 | — | — | EP | disclosed |
| US-20040106764-A1 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | SUZUKI HIROSHI (JP) | 2004-06-03 | — | — | US | disclosed |
| US-6727325-B1 | HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY | NIPPON SODA CO. LTD. (JP) | 2004-04-27 | — | — | US | disclosed |
| EP-0949286-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-10-13 | — | — | EP | disclosed |