SCHEMBL2331004

SCHEMBL2331004

CCC(N)C1CNCCN1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28328482 0.81
SCHEMBL9771533 0.78 KCNH2 (0.30)
SCHEMBL25263944 0.78 KCNH2 (0.34)
SCHEMBL25698381 0.78
SCHEMBL5202320 0.77 KDM4E (0.31)
SCHEMBL14381086 0.77 KDM4E (0.31)
SCHEMBL11233691 0.77 KDM4E (0.31)
SCHEMBL1923855 0.76
SCHEMBL1408397 0.75 GBA1 (0.41)
SCHEMBL5242266 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113631624-B Curing agent composition for epoxy resin compounds, epoxy resin compounds with improved low temperature curing and multicomponent epoxy resin systems 喜利得股份公司 2023-10-20 CN claimed
US-20220213259-A1 Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system with improved low-temperature curing HILTI AKTIENGESELLSCHAFT (LI) 2022-07-07 US claimed
CN-113631624-A Curing agent composition for epoxy resin compounds, epoxy resin compounds with improved low temperature cure, and multi-component epoxy resin systems 喜利得股份公司 2021-11-09 CN claimed
EP-4370575-A1 EPOXY RESIN MIXTURES COMPRISING EPOXIDE-ACRYLATE HYBRID MOLECULES AND MULTICOMPONENT REACTIVE RESIN COMPOSITIONS THEREFROM Hilti Aktiengesellschaft (LI) 2024-05-22 EP disclosed
EP-4370576-A1 EPOXIDE-ACRYLATE HYBRID MOLECULES AND THEIR USE FOR CHEMICAL ANCHORING Hilti Aktiengesellschaft (LI) 2024-05-22 EP disclosed
CN-112673043-B Curing agent composition for epoxy resin mixtures, epoxy resin mixtures and multicomponent epoxy resin systems 喜利得股份公司 2024-03-29 CN disclosed
EP-4323324-A1 MULTI-COMPONENT EPOXY RESIN MATERIAL WITH FINE FILLERS Hilti Aktiengesellschaft (LI) 2024-02-21 EP disclosed
WO-2024017659-A1 TERTIARY AMINES FOR IMPROVING THE CREEP BEHAVIOUR OF CHEMICAL DOWELS HILTI AKTIENGESELLSCHAFT (LI) 2024-01-25 WO disclosed
WO-2024017652-A1 MULTI-COMPONENT COMPOSITION FOR SECUREMENT USES WITH NON-STOICHIOMETRIC EEW/AHEW FRACTIONS, MORTAR COMPOUND PRODUCED THEREFROM AND CHEMICAL ANCHOR PRODUCED THEREFROM HILTI AKTIENGESELLSCHAFT (LI) 2024-01-25 WO disclosed
WO-2024017661-A1 CHEMICAL ANCHOR SYSTEM HILTI AKTIENGESELLSCHAFT (LI) 2024-01-25 WO disclosed
EP-4310125-A1 TERTIARY AMINES FOR IMPROVING THE CREEP BEHAVIOR OF CHEMICAL DOWELS Hilti Aktiengesellschaft (LI) 2024-01-24 EP disclosed
EP-1838750-A1 COATING SYSTEM Huntsman Advanced Materials (Switzerland) GmbH (CH) 2007-10-03 EP disclosed
WO-2007085598-A1 CURABLE COMPOSITION HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2007-08-02 WO disclosed
EP-1810985-A1 Curable composition Huntsman Advanced Materials (Switzerland) GmbH (CH) 2007-07-25 EP disclosed
WO-2006067195-A1 COATING SYSTEM HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2006-06-29 WO disclosed
EP-1674495-A1 Coating system Huntsman Advanced Materials (Switzerland) GmbH (CH) 2006-06-28 EP disclosed
US-5198519-A SILAZANE POLYMERS AND METHOD OF MAKING SAME THE STANDARD OIL COMPANY (US) 1993-03-30 US disclosed
EP-0510827-A2 Silazane polymers and method of making same THE STANDARD OIL COMPANY (US) 1992-10-28 EP disclosed
US-4500452-A NOT SUBJECT TO ENZYME DEACTIVATION NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1985-02-19 US disclosed
US-4472304-A CARCINOSTATIC NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1984-09-18 US disclosed