SCHEMBL2332955

SCHEMBL2332955

NCC1CCCCC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12753799 0.98 CA1 (0.47)
SCHEMBL6264687 0.93
Hydrochloric Acid SCHEMBL31674355 0.91
SCHEMBL23163117 0.84 KDM4E (0.49)
SCHEMBL17428413 0.80 CA1 (0.45)
SCHEMBL5918112 0.80 CA1 (0.48)
Hydrochloric Acid SCHEMBL9134089 0.79 CA1 (0.43)
SCHEMBL11058566 0.76 KDM4E (0.50)
SCHEMBL11669057 0.76 KDM4E (0.50)
SCHEMBL14301484 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106459703-B Polyolefins adhesive composition 东洋纺株式会社 2018-09-25 CN claimed
CN-110527470-A A kind of Adhesive composition for FFC SUZHOU MACROOCEAN NEW MAT CO LTD 2019-12-03 CN disclosed
CN-107674388-B Halogen-free resin composition and glue film prepared therefrom, cover film and copper-clad plate 广东生益科技股份有限公司 2019-10-08 CN disclosed
CN-107109182-B Laminated body containing low dielectric adhesive layer 东洋纺株式会社 2019-06-07 CN disclosed
CN-109563385-A Polyolefin adhesive composition 东洋纺株式会社 2019-04-02 CN disclosed
CN-109476969-A Polyolefin adhesive composition 东洋纺株式会社 2019-03-15 CN disclosed
CN-106459703-B Polyolefins adhesive composition 东洋纺株式会社 2018-09-25 CN disclosed
CN-105492534-B Polyurethane resin composition, and adhesive composition, laminate, and printed wiring board using same 东洋纺株式会社 2018-09-21 CN disclosed
CN-107674388-A Halogen-free resin composition and glued membrane prepared therefrom, cover layer and copper-clad plate 广东生益科技股份有限公司 2018-02-09 CN disclosed
CN-107109182-A Layered product containing low dielectric adhesive layer 东洋纺株式会社 2017-08-29 CN disclosed
CN-106459703-A Polyolefin-based adhesive composition 东洋纺株式会社 2017-02-22 CN disclosed
CN-105492534-A Polyurethane resin composition, and adhesive composition, laminate, and printed wiring board using same TOYO BOSEKI 2016-04-13 CN disclosed
US-8030522-B2 Process for the production of toluene diisocyanate BAYER MATERIALSCIENCE LLC (US) 2011-10-04 US disclosed
EP-1864969-B1 Process for the production of the toluene diisocyanate BAYER MATERIALSCIENCE AG (DE) 2011-08-17 EP disclosed
EP-1530462-B1 1-PHENYL-2-DIMETHYLAMINOMETHYL CYCLOHEXANE COMPOUNDS USED FOR THE THERAPY OF DEPRESSIVE SYMPTOMS, PAIN, AND INCONTINENCE GRUENENTHAL GMBH (DE) 2010-12-15 EP disclosed
US-20070287857-A1 Process for the production of toluene diisocyanate COVESTRO DEUTSCHLAND AG (DE) 2007-12-13 US disclosed
EP-1864969-A1 Process for the production of the toluene diisocyanate Bayer MaterialScience AG (DE) 2007-12-12 EP disclosed
EP-1572653-A1 SATURATED AND UNSATURATED HETEROARYLCYCLOALKYLMETHYL AMINES AS ANTI-DEPRESSANTS Grünenthal GmbH (DE) 2005-09-14 EP disclosed
WO-2004063161-A1 SATURATED AND UNSATURATED HETEROARYLCYCLOALKYLMETHYL AMINES AS ANTI-DEPRESSANTS Grünenthal GmbH (DE) 2004-07-29 WO disclosed