SCHEMBL2333401

SCHEMBL2333401

[Pd]Nc1ccccn1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4754894 0.79
SCHEMBL4754893 0.79
SCHEMBL29391624 0.78 KMT2A (0.76)
SCHEMBL221242 0.78 KMT2A (0.76)
SCHEMBL10405315 0.78 MEN1 (0.61)
SCHEMBL30947359 0.76 KMT2A (0.73)
SCHEMBL6574416 0.76 KMT2A (0.73)
SCHEMBL6175584 0.76 KMT2A (0.73)
SCHEMBL4243882 0.76 KMT2A (0.73)
SCHEMBL11133606 0.76 KMT2A (0.73)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3660189-B1 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH & CO KG (DE) 2023-11-15 EP disclosed
EP-3660189-A1 COMPOSITION AND PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH Deutschland GmbH (DE) 2020-06-03 EP disclosed
EP-3126547-B1 COMPOSITION AND PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2020-03-04 EP disclosed
CN-106471155-B For making the composition and method of nonconductive plastic material surface metalation 安美特德国有限公司 2019-11-15 CN disclosed
US-10377947-B2 Composition and process for metallizing nonconductive plastic surfaces ATOTECH DEUTSCHLAND GMBH (DE) 2019-08-13 US disclosed
US-20190144747-A1 COMPOSITION AND PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH USA, LLC 2019-05-16 US disclosed
US-10174250-B2 Composition and process for metallizing nonconductive plastic surfaces ATOTECH DEUTSCHLAND GMBH (DE) 2019-01-08 US disclosed
US-9920432-B2 Adhesion promoting agents for metallization of substrate surfaces ATOTECH DEUTSCHLAND GMBH (US) 2018-03-20 US disclosed
EP-2788529-B1 NOVEL ADHESION PROMOTING AGENTS FOR METALLIZATION OF SUBSTRATE SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2017-08-23 EP disclosed
CN-104302809-B The adhesion promotor metallized for substrate surface 埃托特克德国有限公司 2017-07-21 CN disclosed
EP-2788529-A2 NOVEL ADHESION PROMOTING AGENTS FOR METALLIZATION OF SUBSTRATE SURFACES ATOTECH Deutschland GmbH (DE) 2014-10-15 EP disclosed
WO-2014087004-A1 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-12 WO disclosed
WO-2013182590-A1 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2013-12-12 WO disclosed
WO-2013135862-A2 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2013-09-19 WO disclosed
WO-2013135864-A1 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2013-09-19 WO disclosed
WO-2013135863-A1 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2013-09-19 WO disclosed
WO-2013083600-A2 NOVEL ADHESION PROMOTING AGENTS FOR METALLIZATION OF SUBSTRATE SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2013-06-13 WO disclosed
EP-2602357-A1 Novel adhesion promoting agents for metallization of substrate surfaces Atotech Deutschland GmbH (DE) 2013-06-12 EP disclosed
US-20120305406-A1 Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface ATOTECH DEUTSCHLAND GMBH (DE) 2012-12-06 US disclosed
WO-2011098428-A1 METHOD FOR METALLISING OBJECTS WHICH HAVE AT LEAST TWO DIFFERENT PLASTICS ON THE SURFACE ATOTECH DEUTSCHLAND GMBH (DE) 2011-08-18 WO disclosed