Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.44 |
| ▸ | PDGFRB | P09619 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | RECQL | P46063 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.36 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.36 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.36 |
| ▸ | CHRNA7 | P36544 | 1/20 | 0.36 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29403090 | 0.78 | PDGFRB (0.64) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL993337 | 0.78 | PDGFRB (0.64) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL14994638 | 0.74 | PDGFRB (0.41) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL25233419 | 0.73 | GAA (0.40) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL5311833 | 0.71 | PDGFRB (0.61) | PDGFRBMEN1HTTKMT2A | |
| SCHEMBL30541821 | 0.70 | PDGFRB (0.73) | PDGFRBGAAALDH1A1TSHRMEN1 | |
| SCHEMBL1830962 | 0.70 | RECQL (0.44) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL21970985 | 0.69 | PDGFRB (0.49) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL15340880 | 0.68 | RECQL (0.43) | POLBPDGFRBGAAALDH1A1RECQL | |
| SCHEMBL1836103 | 0.68 | RECQL (0.54) | POLBGAAALDH1A1RECQLTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4711402-A1 | TABLET-SHAPED EPOXY RESIN MOLDING MATERIAL, COLUMNAR TABLET, AND METHOD FOR PRODUCING COLUMNAR TABLET | Sumitomo Bakelite Co.Ltd. (JP) | 2026-03-18 | — | — | EP | disclosed |
| EP-4685187-A1 | EPOXY RESIN COMPOSITION PARTICLE, TABLET, AND METHOD FOR PRODUCING COLUMNAR TABLET | Sumitomo Bakelite Co.Ltd. (JP) | 2026-01-28 | — | — | EP | disclosed |
| US-20250279392-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| US-20250197628-A1 | RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED ENCAPSULATION STRUCTURE | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| US-20250121537-A1 | RESIN COMPOSITION FOR INJECTION MOLDING AND METHOD FOR INJECTION-MOLDING THIS COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-04-17 | — | — | US | disclosed |
| EP-4503118-A1 | RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED-ENCAPSULATION STRUCTURE | Sumitomo Bakelite Co., Ltd. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-20250038601-A1 | THERMOSETTING RESIN COMPOSITION AND STATOR | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-01-30 | — | — | US | disclosed |
| EP-4477714-A1 | RESIN COMPOSITION FOR INJECTION MOLDING AND METHOD FOR INJECTION-MOLDING THIS COMPOSITION | Sumitomo Bakelite Co.Ltd. (JP) | 2024-12-18 | — | — | EP | disclosed |
| CN-111716847-B | Sealing sheet | 日东电工株式会社 | 2024-12-13 | — | — | CN | disclosed |
| CN-111716848-B | Sealing sheet | 日东电工株式会社 | 2024-12-13 | — | — | CN | disclosed |
| US-20120261174-A1 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-10-18 | — | — | US | disclosed |
| US-8269213-B2 | Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same | NITTO DENKO CORPORATION (JP) | 2012-09-18 | — | — | US | disclosed |
| EP-2495818-A1 | CONDUCTIVE CONNECTION MATERIAL AND TERMINAL-TO-TERMINAL CONNECTION METHOD USING SAME | Sumitomo Bakelite Company Limited (JP) | 2012-09-05 | — | — | EP | disclosed |
| US-20120214010-A1 | CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-08-23 | — | — | US | disclosed |
| EP-2484739-A1 | CONDUCTIVE CONNECTION MATERIAL, METHOD FOR CONNECTION BETWEEN TERMINALS AND METHOD FOR MANUFACTURING CONNECTING TERMINAL | Sumitomo Bakelite Company Limited (JP) | 2012-08-08 | — | — | EP | disclosed |
| US-20120183781-A1 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| EP-2357876-A1 | ELECTROCONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS TO EACH OTHER USING THE ELECTROCONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR MANUFACTURING CONNECTING TERMINAL | Sumitomo Bakelite Company Limited (JP) | 2011-08-17 | — | — | EP | disclosed |
| US-20100148379-A1 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME | NITTO DENKO CORPORATION (JP) | 2010-06-17 | — | — | US | disclosed |
| US-6333369-B1 | COATING A RESIN FOR TRANSFER PRINTING, EPOXY RESINS, HARDENER, ACCELERATION AND SOLVENTS, MIXING WITH TRIETHANOL AMINE AND DIETHANOLAMINE AND HARDENING | KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY (KR) | 2001-12-25 | — | — | US | disclosed |
| WO-1999055757-A1 | A COATING RESIN COMPOSITION FOR TRANSFER PRINTING | KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY (KR) | 1999-11-04 | — | — | WO | disclosed |