SCHEMBL233481

SCHEMBL233481

C=CCOC(F)=C(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4361874 0.77 CYP3A4 (0.32)
SCHEMBL27476583 0.76 CA1 (0.38)
SCHEMBL822080 0.75 CYP3A4 (0.31)
SCHEMBL3423069 0.74
SCHEMBL17818352 0.72
SCHEMBL1079961 0.72
SCHEMBL8637003 0.72
SCHEMBL6695619 0.71 CYP3A4 (0.38)
Tetrafluoroethylene SCHEMBL27512569 0.71 CA1 (0.41)
SCHEMBL10887615 0.70 CYP3A4 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 690 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115703698-A Preparation method of trifluorovinyl alkyl ether compound and intermediate thereof 中国科学院上海有机化学研究所 2023-02-17 CN claimed
CN-115663112-A Electrode slice comprising colored insulating coating, preparation method of electrode slice and lithium ion battery 湖北亿纬动力有限公司 2023-01-31 CN claimed
US-9834631-B2 Fluoropolymer production method DAIKIN INDUSTRIES, LTD. (JP) 2017-12-05 US claimed
US-20160108159-A1 FLUOROPOLYMER PRODUCTION METHOD DAIKIN INDUSTRIES, LTD. (JP) 2016-04-21 US claimed
EP-3006473-A1 FLUOROPOLYMER PRODUCTION METHOD Daikin Industries, Ltd. (JP) 2016-04-13 EP claimed
EP-1741732-B1 CHLOROTRIFLUOROETHYLENE COPOLYMER DAIKIN IND LTD (JP) 2013-06-19 EP claimed
EP-2401748-A1 MULTI-LAYER INSULATED CONDUCTOR WITH CROSSLINKED OUTER LAYER Tyco Electronics Corporation (US) 2012-01-04 EP claimed
WO-2010098846-A1 MULTI-LAYER INSULATED CONDUCTOR WITH CROSSLINKED OUTER LAYER TYCO ELECTRONICS CORPORATION (US) 2010-09-02 WO claimed
US-20100218975-A1 Multi-layer insulated conductor with crosslinked outer layer TYCO ELECTRONICS CORPORATION (US) 2010-09-02 US claimed
EP-0915105-B1 Plastic substrates for electronic display applications ROHM & HAAS (US) 2003-04-09 EP claimed
US-6495636-B2 A 3-(ETHYLENEOXYALKYLOXYALKYL)OXETANE AND DERIVATIVES; COPOLYMERIZED WITH A 1,1-DIFLUOROETHYLENE OR DERIVATIVE; VERY COMPATIBLE AND COPOLYMERIZABLE WITH UNSATURATED COMPOUNDS; WATERPROOFING; RADIATION TRANSPARENT JSR CORPORATION (JP) 2002-12-17 US claimed
US-4847401-A Continuous large-scale production of ethyl 2,2-difluoro-4-pentenoate and 2-fluorinated methyl aminoacetonitriles by use of a flow reactor MERRELL DOW PHARMACEUTICALS INC. (US) 1989-07-11 US claimed
EP-0230144-B1 FLOW REACTOR SYSTEM MERRELL DOW PHARMACEUTICALS INC. (US) 1989-03-29 EP claimed
EP-0230144-A1 Flow reactor system MERRELL DOW PHARMACEUTICALS INC. (US) 1987-07-29 EP claimed
US-4600651-A SILICONES, BONDING E. I. DU PONT DE NEMOURS AND COMPANY (US) 1986-07-15 US claimed
US-4068034-A Heat-insulation laminate of polyvinylidene fluoride, metal and plastic KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JA) 1978-01-10 US claimed
JP-63218715-A None JP disclosed
US-12036714-B2 Molding material and tube DAIKIN INDUSTRIES, LTD. (JP) 2024-07-16 US disclosed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP disclosed
EP-0008542-A2 Method of manufacturing xergraphic fuser roll having an abhesive surface XEROX CORPORATION (US) 1980-03-05 EP disclosed