SCHEMBL2340356

SCHEMBL2340356

CC=CC(O)C(O)CNCC

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.39
LMNA P02545 1/20 0.30
HIF1A Q16665 1/20 0.30
GALR3 O60755 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1846261 0.77
SCHEMBL1846260 0.77
SCHEMBL8532617 0.72 KDM4E (0.38) KDM4E
SCHEMBL26254545 0.70
SCHEMBL24795349 0.69
SCHEMBL15010789 0.69
SCHEMBL15010788 0.69
SCHEMBL11448630 0.69
SCHEMBL11744825 0.69
SCHEMBL123685 0.68 KDM4E (0.60) KDM4ELMNAHIF1AGALR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1201644-B1 A process for the prepraration of a dihydroxyamino compound DAICEL CHEM (JP) 2011-08-24 EP disclosed
EP-1201644-A2 A process for the prepration of a dihydroxyamino compound Daicel Chemical Industries, Ltd. (JP) 2002-05-02 EP disclosed
US-5874624-A REACTING EPOXY COMPOUND AND AN AMINO COMPOUND AT A SPECIFIED TEMPERATURE AND PRESSURE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1999-02-23 US disclosed
EP-0839802-A2 A process for the preparation of a dihydroxyamino compound DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-05-06 EP disclosed