Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9012103 | 0.85 | — | — | |
| SCHEMBL3783621 | 0.76 | CYP3A4 (0.36) | CYP3A4 | |
| Hydrochloric Acid SCHEMBL8987265 | 0.76 | CYP3A4 (0.36) | CYP3A4 | |
| Hydrochloric Acid SCHEMBL29029668 | 0.71 | FFAR3 (0.31) | — | |
| SCHEMBL11757984 | 0.71 | — | — | |
| SCHEMBL11757963 | 0.71 | — | — | |
| SCHEMBL126906 | 0.69 | FFAR3 (0.32) | — | |
| Hydrochloric Acid SCHEMBL26928569 | 0.68 | NSD2 (0.30) | — | |
| SCHEMBL10614968 | 0.67 | — | — | |
| SCHEMBL2874658 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108440913-A | High-dielectric-property copper-clad plate and preparation method thereof | 苏州巨峰新材料科技有限公司 | 2018-08-24 | — | — | CN | claimed |
| US-12516139-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-06 | — | — | US | disclosed |
| EP-4321541-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-12221523-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-02-11 | — | — | US | disclosed |
| EP-4074740-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2024-11-20 | — | — | EP | disclosed |
| US-20240309127-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-09-19 | — | — | US | disclosed |
| US-20240287219-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-08-29 | — | — | US | disclosed |
| US-20240287347-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-08-29 | — | — | US | disclosed |
| US-20240279432-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-08-22 | — | — | US | disclosed |
| US-20240174809-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-05-30 | — | — | US | disclosed |
| WO-2022201621-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| US-20220204695-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-06-30 | — | — | US | disclosed |
| EP-3916025-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-01 | — | — | EP | disclosed |
| WO-2021117762-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2021-06-17 | — | — | WO | disclosed |
| CN-110187604-A | Photosensitive polymer combination, dry film and printed wiring board | 互应化学工业株式会社 | 2019-08-30 | — | — | CN | disclosed |
| CN-107710074-B | Solder resist composition, coating film, coated printed wiring board, method for producing coating film, and method for producing coated printed wiring board | 互应化学工业株式会社 | 2019-07-16 | — | — | CN | disclosed |
| CN-109791354-A | Photosensitive resin composition, dry film and printed wiring board | 互应化学工业株式会社 | 2019-05-21 | — | — | CN | disclosed |
| CN-108192077-A | A kind of preparation method of photosensitive resin with flame retardant property and its application in the circuit board | 盐城艾肯科技有限公司 | 2018-06-22 | — | — | CN | disclosed |
| CN-107710074-A | Solder resist composition, coating film, coated printed wiring board, method for producing coating film, and method for producing coated printed wiring board | 互应化学工业株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107498967-A | Easily-processed heat-insulating composite material and preparation method thereof | 嘉兴立新材料有限公司 | 2017-12-22 | — | — | CN | disclosed |