SCHEMBL23526652

SCHEMBL23526652

CCCCO[Si](C)(CCS[Si](CC)(CC)CC)OCCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23526501 0.91
SCHEMBL23526739 0.89
SCHEMBL23526640 0.85
SCHEMBL23526810 0.85 SMN1; SMN2 (0.31)
SCHEMBL23526697 0.83
SCHEMBL23526512 0.81
SCHEMBL23526665 0.81 SMN1; SMN2 (0.31)
SCHEMBL23526771 0.80
SCHEMBL23526758 0.80
SCHEMBL23526616 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11884760-B2 Production method for branched conjugated diene-based polymer, production method for rubber composition, production method for tire, branched conjugated diene-based polymer, and branched conjugated diene-based polymer composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-01-30 US disclosed
US-11732115-B2 Tire for vehicle wheels PIRELLI TYRE S.P.A. (IT) 2023-08-22 US disclosed
EP-3845568-A2 PRODUCTION METHOD FOR BRANCHED CONJUGATED DIENE-BASED POLYMER, PRODUCTION METHOD FOR RUBBER COMPOSITION, PRODUCTION METHOD FOR TIRE, BRANCHED CONJUGATED DIENE-BASED POLYMER, AND BRANCHED CONJUGATED DIENE-BASED POLYMER COMPOSITION Asahi Kasei Kabushiki Kaisha (JP) 2021-07-07 EP disclosed
US-20210189039-A1 Production Method for Branched Conjugated Diene-Based Polymer, Production Method for Rubber Composition, Production Method for Tire, Branched Conjugated Diene-Based Polymer, and Branched Conjugated Diene-Based Polymer Composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-06-24 US disclosed