SCHEMBL2354772

SCHEMBL2354772

CC1CC(C2CO2)OC1C1CO1

nearest known ligand 0.42

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
PPP5C P53041 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Oxirane SCHEMBL15824456 0.74
SCHEMBL12292920 0.70
SCHEMBL2764333 0.69
SCHEMBL14114669 0.69 PPP5C (0.40) PPP5C
SCHEMBL13445772 0.69 PPP5C (0.45) PPP5C
SCHEMBL4391836 0.69
SCHEMBL13183034 0.69
SCHEMBL9320031 0.68
SCHEMBL21300119 0.68
SCHEMBL4459831 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2477215-A2 Resin composition, embedding material, insulating layer and semiconductor device Sumitomo Bakelite Company Limited (JP) 2012-07-18 EP disclosed
US-7999354-B2 Resin composition, filling material, insulating layer and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-08-16 US disclosed
US-20100181684-A1 RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-07-22 US disclosed
EP-2166036-A1 RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company Limited (JP) 2010-03-24 EP disclosed
EP-1593522-B1 Lithographic printing plate precursor FUJIFILM CORP (JP) 2008-02-27 EP disclosed