⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL49675 | 0.71 | — | — | |
| SCHEMBL16198876 | 0.69 | — | — | |
| SCHEMBL16840811 | 0.69 | — | — | |
| SCHEMBL13287433 | 0.69 | — | — | |
| SCHEMBL233848 | 0.67 | — | — | |
| SCHEMBL15489251 | 0.63 | — | — | |
| SCHEMBL2101952 | 0.63 | — | — | |
| SCHEMBL27868497 | 0.63 | — | — | |
| SCHEMBL2100842 | 0.63 | — | — | |
| SCHEMBL28008175 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12049576-B2 | Silicone pressure sensitive adhesive and method of making the same | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2024-07-30 | — | — | US | claimed |
| EP-4320180-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE AND METHOD OF MAKING THE SAME | Momentive Performance Materials Inc. (US) | 2024-02-14 | — | — | EP | claimed |
| CN-117377716-A | Organosilicon pressure-sensitive adhesive and method for preparing same | 迈图高新材料公司 | 2024-01-09 | — | — | CN | claimed |
| WO-2022216482-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE AND METHOD OF MAKING THE SAME | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-10-13 | — | — | WO | claimed |
| US-20220325154-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE AND METHOD OF MAKING THE SAME | MOMENTIVE PERFORMANCE MATERIALS INC. | 2022-10-13 | — | — | US | claimed |
| JP-60221311-A | — | — | None | — | — | JP | disclosed |
| US-12049576-B2 | Silicone pressure sensitive adhesive and method of making the same | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2024-07-30 | — | — | US | disclosed |
| EP-4320180-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE AND METHOD OF MAKING THE SAME | Momentive Performance Materials Inc. (US) | 2024-02-14 | — | — | EP | disclosed |
| CN-117377716-A | Organosilicon pressure-sensitive adhesive and method for preparing same | 迈图高新材料公司 | 2024-01-09 | — | — | CN | disclosed |
| US-20220325154-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE AND METHOD OF MAKING THE SAME | MOMENTIVE PERFORMANCE MATERIALS INC. | 2022-10-13 | — | — | US | disclosed |
| WO-2022216482-A1 | SILICONE PRESSURE SENSITIVE ADHESIVE AND METHOD OF MAKING THE SAME | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-10-13 | — | — | WO | disclosed |
| US-9556513-B2 | Molding, production method therefor, part for electronic devices and electronic device | LINTEC CORPORATION (JP) | 2017-01-31 | — | — | US | disclosed |
| US-20100190942-A1 | AMINOSILANE COMPOUNDS, CATALYST COMPONENTS AND CATALYSTS FOR OLEFIN POLYMERIZATION, AND PROCESS FOR PRODUCTION OF OLEFIN POLYMERS WITH THE SAME | TOHO CATALYST CO., LTD. (JP) | 2010-07-29 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |
| EP-1908767-A1 | AMINOSILANE COMPOUNDS, CATALYST COMPONENTS AND CATALYSTS FOR OLEFIN POLYMERIZATION, AND PROCESS FOR PRODUCTION OF OLEFIN POLYMERS WITH THE SAME | Toho Catalyst Co., Ltd. (JP) | 2008-04-09 | — | — | EP | disclosed |
| WO-2003072756-A2 | CLONING AND CHARACTERIZATION OF SLC26A8 AND SLC26A11 ANION EXCHANGERS | VANDERBILT UNIVERSITY (US) | 2003-09-04 | — | — | WO | disclosed |
| WO-1994001487-A1 | MONODISPERSED POLYDIMETHYLSILOXANE-α,φ-DIOL FLUIDS AND α,β-SUBSTITUTED POLYDIMETHYLSILOXANES | TEMPLE UNIVERSITY - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION (US) | 1994-01-20 | — | — | WO | disclosed |
| US-5254654-A | Molecular weight control | TEMPLE UNIVERSITY OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION (US) | 1993-10-19 | — | — | US | disclosed |
| WO-1992017527-A1 | POLYSILAZANES AND PROCESS FOR THEIR PREPARATION | ETAT FRANÇAIS représenté par le DELEGUE GENERAL POUR L'ARMEMENT (FR) | 1992-10-15 | — | — | WO | disclosed |
| JP-S60221311-A | AMORPHOUS COMPOSITION | MITSUBISHI GAS CHEM CO INC | 1985-11-06 | — | — | JP | disclosed |