SCHEMBL23604688

SCHEMBL23604688

CCCCN1c2ccccc2C(C)(C)C12C=Cc1cc(O)ccc1O2

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 7/20 0.71
GAA P10253 5/20 0.71
MEN1 O00255 4/20 0.71
KMT2A Q03164 4/20 0.71
TDP1 Q9NUW8 4/20 0.71
NPSR1 Q6W5P4 3/20 0.71
LMNA P02545 3/20 0.71
RECQL P46063 3/20 0.71
ALPG P10696 1/20 0.71
TP53 P04637 1/20 0.71
ALOX15 P16050 1/20 0.71
HSD17B10 Q99714 1/20 0.71
THRB P10828 4/20 0.62
SMN1; SMN2 Q16637 4/20 0.62
PKM P14618 2/20 0.62
PLIN1 O60240 1/20 0.62
TSHR P16473 1/20 0.62
PLIN5 Q00G26 1/20 0.62
ABHD5 Q8WTS1 1/20 0.62
PTGS1 P23219 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10492371 0.96 MAPT (0.69) MAPTGAAMEN1KMT2ATDP1
SCHEMBL29633525 0.96 MAPT (0.69) MAPTGAAMEN1KMT2ATDP1
SCHEMBL20996833 0.89 MAPT (0.76) MAPTGAAMEN1KMT2ATDP1
SCHEMBL22810770 0.88 MAPT (0.59) MAPTGAAMEN1KMT2ATDP1
SCHEMBL8682067 0.88 MAPT (0.59) MAPTGAAMEN1KMT2ATDP1
SCHEMBL8685153 0.87 MAPT (0.57) MAPTGAAMEN1KMT2ATDP1
SCHEMBL20253060 0.84 MAPT (0.58) MAPTGAAMEN1KMT2ATDP1
SCHEMBL11789014 0.84 MAPT (0.55) MAPTGAAMEN1KMT2ATDP1
SCHEMBL29823656 0.84 MAPT (0.55) MAPTGAAMEN1KMT2ATDP1
SCHEMBL16315815 0.84 MAPT (0.56) MAPTGAAMEN1KMT2ATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11347148-B2 Patterning method and method for manufacturing array substrate BOE TECHNOLOGY GROUP CO., LTD. (CN) 2022-05-31 US disclosed
US-20210200090-A1 Patterning Method and Method for Manufacturing Array Substrate BOE TECHNOLOGY GROUP CO., LTD. (CN) 2021-07-01 US disclosed