⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28612437 | 0.69 | — | — | |
| SCHEMBL8522405 | 0.66 | — | — | |
| SCHEMBL6278856 | 0.66 | — | — | |
| SCHEMBL27933925 | 0.64 | — | — | |
| SCHEMBL28454156 | 0.64 | — | — | |
| SCHEMBL28354522 | 0.64 | — | — | |
| SCHEMBL28848079 | 0.63 | — | — | |
| SCHEMBL21979533 | 0.62 | — | — | |
| SCHEMBL17448553 | 0.62 | — | — | |
| SCHEMBL21378832 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12321097-B2 | Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper | ECHEM SOLUTIONS CORP. (TW) | 2025-06-03 | — | — | US | disclosed |
| US-20210223699-A1 | METHOD OF REMOVING PHOTORESIST, LAMINATE, METHOD OF FORMING METALLIC PATTERN, POLYIMIDE RESIN AND STRIPPER | ECHEM SOLUTIONS CORP. (TW) | 2021-07-22 | — | — | US | disclosed |