SCHEMBL237319

SCHEMBL237319

CC(C)(CS)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL237175 0.75
SCHEMBL333714 0.71
SCHEMBL333853 0.71
SCHEMBL6037357 0.69
SCHEMBL6037367 0.69
SCHEMBL6037377 0.69
SCHEMBL6037324 0.69
SCHEMBL27815 0.69
SCHEMBL9082281 0.69
SCHEMBL702302 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119569769-A Preparation method of sulfhydryl and trimethylsilyl-containing silane 湖北康和园新材料有限公司 2025-03-07 CN claimed
US-9046515-B2 Polymer compound for medical material, and biochip substrate using the polymer compound SUMITOMO BAKELITE COMPANY, LTD. (JP) 2015-06-02 US claimed
US-12545747-B2 Method, kit, and device for preparing glycan from glycoprotein NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2026-02-10 US disclosed
US-12240868-B2 Organic silicon compound and production method therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-03-04 US disclosed
US-20240279459-A1 Curable Composition and Cured Product SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2024-08-22 US disclosed
EP-3543246-B1 COMPOSITION CONTAINING ORGANIC SILICON COMPOUND AND PAINT AND ADHESIVE CONTAINING SAID COMPOSITION SHINETSU CHEMICAL CO (JP) 2024-05-15 EP disclosed
EP-4353755-A1 CURABLE COMPOSITION AND CURED PRODUCT Soken Chemical & Engineering Co., Ltd. (JP) 2024-04-17 EP disclosed
CN-117529524-A Curable composition and cured product 综研化学株式会社 2024-02-06 CN disclosed
CN-117425695-A Curable composition and cured product 综研化学株式会社 2024-01-19 CN disclosed
CN-117413017-A Curable composition, cured product, and 2-liquid type curable composition 综研化学株式会社 2024-01-16 CN disclosed
EP-3783037-B1 POLYMER HAVING REACTIVE SILICON-CONTAINING GROUP AND PRODUCTION METHOD THEREFOR SHINETSU CHEMICAL CO (JP) 2024-01-10 EP disclosed
US-5877232-A WEAR RESISTANCE; DIMENSIONAL STABILITY; SHRINKAGE INHIBITION THE PROCTER & GAMBLE COMPANY (US) 1999-03-02 US disclosed
EP-0471164-B1 Process for the preparation of mercaptosilanes HUELS CHEMISCHE WERKE AG (DE) 1995-11-15 EP disclosed
EP-0643752-A1 RESINOUS DENTAL COMPOSITION BASED ON POLYMERISABLE POLYSILOXANES THE PROCTER & GAMBLE COMPANY (US) 1995-03-22 EP disclosed
EP-0643752-A4 RESINOUS DENTAL COMPOSITION BASED ON POLYMERISABLE POLYSILOXANES. PROCTER & GAMBLE (US) 1994-06-03 EP disclosed
WO-1993007230-A1 RESINOUS DENTAL COMPOSITION BASED ON POLYMERISABLE POLYSILOXANES THE PROCTER & GAMBLE COMPANY (US) 1993-04-15 WO disclosed
US-5120800-A Boriding with borane compound having at least one boron-hydrogen bond and oxidizing MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1992-06-09 US disclosed
US-5107009-A PROCESS FOR THE PREPARATION OF MERCAPTOSILANES HULS AKTIENGESELLSCHAFT (DE) 1992-04-21 US disclosed
EP-0471164-A1 Process for the preparation of mercaptosilanes HÜLS AKTIENGESELLSCHAFT (DE) 1992-02-19 EP disclosed
EP-0451819-A2 Process for preparing modified-polyphenylene ether MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-10-16 EP disclosed