⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27845195 | 1.00 | — | — | |
| SCHEMBL28193931 | 1.00 | — | — | |
| SCHEMBL1955166 | 0.82 | — | — | |
| SCHEMBL4867535 | 0.82 | — | — | |
| SCHEMBL1930282 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL25209109 | 0.82 | — | — | |
| SCHEMBL5570762 | 0.82 | — | — | |
| SCHEMBL18043783 | 0.82 | — | — | |
| SCHEMBL8427385 | 0.82 | — | — | |
| Water SCHEMBL22076909 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1749 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3900009-B1 | METHOD TO PRODUCE A PIEZOELECTRIC COATING AND VACUUM APPARATUS | EVATEC AG (CH) | 2026-05-27 | — | — | EP | claimed |
| CN-122061050-A | Ternary rare earth modified high-strength aluminum-silicon alloy and preparation method thereof | 山东宏桥轻量化科技有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-117802366-B | High specific strength 3D printing aluminum alloy and preparation method thereof | 有研增材技术有限公司 | 2026-05-15 | — | — | CN | claimed |
| US-12601040-B2 | Aluminum scandium alloy target and method of manufacturing the same | HUNAN RARE EARTH METAL MATERIAL RESEARCH INSTITUTE CO., LTD. (CN) | 2026-04-14 | — | — | US | claimed |
| US-20250301713-A1 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-09-25 | — | — | US | claimed |
| US-20250232959-A1 | DEPOSITION TOOL WITH DIELECTRIC COATED CHAMBER SIDEWALLS TO IMPROVE ELECTROMANGNETIC FIELD UNIFORMITY | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-07-17 | — | — | US | claimed |
| US-12363957-B2 | Semiconductor device and method of fabricating the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-07-15 | — | — | US | claimed |
| CN-120193188-A | Grain refined Al-Mg-Cu-Sc aluminum alloy intermediate alloy and preparation method thereof | 广西电网有限责任公司电力科学研究院 | 2025-06-24 | — | — | CN | claimed |
| CN-120201922-A | Aluminum nitride doped scandium ferroelectric film memristor and preparation method thereof | 河北大学 | 2025-06-24 | — | — | CN | claimed |
| CN-120115884-A | High-strength aluminum alloy welding wire for vacuum electron beam material increase and preparation method thereof | 北京宇航系统工程研究所 | 2025-06-10 | — | — | CN | claimed |
| CN-1260397-C | Production method of high purity aluminium scandium alloy | ALUMINIUM CORP OF CHINA LTD (CN) | 2006-06-21 | — | — | CN | claimed |
| US-20060032432-A1 | Bulk single crystal gallium nitride and method of making same | WOLFSPEED, INC. | 2006-02-16 | — | — | US | claimed |
| CN-1664170-A | Method for producing aluminium and aluminium alloy by low temperature electrolysis | UNIV SCIENCE & TECH BEIJING (CN) | 2005-09-07 | — | — | CN | claimed |
| CN-1605641-A | Method for preparation of aluminum scandium alloy by alumino-thermic reduction method | HUNAN RES INST OF RARE EARTH M (CN) | 2005-04-13 | — | — | CN | claimed |
| CN-1184356-C | Method of producing aluminium scandium alloy by electrolysis | CHINESEK ALUMINIUM INDUSTRY CO (CN) | 2005-01-12 | — | — | CN | claimed |
| CN-1514042-A | Production method of high purity aluminium scandium alloy | 中国铝业股份有限公司 | 2004-07-21 | — | — | CN | claimed |
| CN-1508273-A | Solid or hollow extruded section containing scandium-aluminum alloy | 萧仲志 | 2004-06-30 | — | — | CN | claimed |
| CN-1410599-A | Method of producing aluminium scandium alloy by electrolysis | CHINESE ALUMINIUM INDUSTRY CO (CN) | 2003-04-16 | — | — | CN | claimed |
| US-5442235-A | Semiconductor device having an improved metal interconnect structure | MOTOROLA INC. (US) | 1995-08-15 | — | — | US | claimed |
| US-5420878-A | Thulium doped lithium fluoride | LIGHTWAVE ELECTRONICS CORPORATION (US) | 1995-05-30 | — | — | US | claimed |