SCHEMBL2380934

SCHEMBL2380934

CC1=CCC1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12677139 1.00
Hydrogen Sulfide SCHEMBL15657642 0.97
SCHEMBL720412 0.80
SCHEMBL11492325 0.76 TSHR (0.30)
SCHEMBL15064229 0.76
SCHEMBL18414273 0.74
SCHEMBL23182686 0.72
SCHEMBL9965842 0.72
SCHEMBL715768 0.71
SCHEMBL719090 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118318208-A Composition for forming catechol-containing drug solution resistant protective film 日产化学株式会社 2024-07-09 CN disclosed
CN-118276405-A Composition for forming resist underlayer film comprising reaction product of acid dianhydride 日产化学株式会社 2024-07-02 CN disclosed
US-20240176243-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-05-30 US disclosed
US-20240168385-A1 PROTECTIVE FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-05-23 US disclosed
US-11976018-B2 Diamine compound, method for manufacturing the same, and applications thereof DAXIN MATERIALS CORP. (TW) 2024-05-07 US disclosed
US-11965059-B2 Chemical-resistant protective film forming composition containing hydroxyaryl-terminated polymer NISSAN CHEMICAL CORPORATION (JP) 2024-04-23 US disclosed
CN-117908332-A Composition for forming resist underlayer film containing radical scavenger 日产化学株式会社 2024-04-19 CN disclosed
US-20240118620-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION INCLUDING REACTION PRODUCT OF ACID DIANHYDRIDE NISSAN CHEMICAL CORPORATION (JP) 2024-04-11 US disclosed
US-20240085792-A1 FILM-FORMING COMPOSITION HAVING A MULTIPLE BOND NISSAN CHEMICAL CORPORATION (JP) 2024-03-14 US disclosed
CN-113383036-B Composition for forming resist underlayer film containing radical scavenger 日产化学株式会社 2024-02-23 CN disclosed
US-8778597-B2 Long-chain alkylene-containing curable epoxy resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-07-15 US disclosed
US-8722311-B2 Positive resist composition and method for producing microlens NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-05-13 US disclosed
US-20130177763-A1 ADHESIVE COMPOSITION CONTAINING RESIN HAVING CARBON-CARBON MULTIPLE BOND NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-07-11 US disclosed
EP-2530524-A1 POSITIVE-TYPE RESIST COMPOSITION AND METHOD FOR PRODUCING MICROLENS Nissan Chemical Industries, Ltd. (JP) 2012-12-05 EP disclosed
EP-2530098-A1 LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2012-12-05 EP disclosed
US-20120292487-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR PRODUCING MICROLENS NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-11-22 US disclosed
US-20120295199-A1 LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-11-22 US disclosed
US-20120251955-A1 COMPOSITION FOR FORMATION OF RESIST UNDERLAYER FILM NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-10-04 US disclosed
US-20110319589-A1 LONG CHAIN ALKYLENE GROUP-CONTAINING EPOXY COMPOUND NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-12-29 US disclosed
US-20110230058-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM WITH REDUCED OUTGASSING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-09-22 US disclosed