⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28006697 | 0.89 | — | — | |
| SCHEMBL28379820 | 0.89 | — | — | |
| SCHEMBL27880606 | 0.89 | — | — | |
| SCHEMBL28368723 | 0.87 | — | — | |
| SCHEMBL4800145 | 0.87 | — | — | |
| SCHEMBL28923741 | 0.87 | — | — | |
| SCHEMBL25217448 | 0.87 | — | — | |
| SCHEMBL28604613 | 0.87 | — | — | |
| SCHEMBL28620261 | 0.87 | — | — | |
| SCHEMBL28862866 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107501953-B | Heat-conducting silicone grease containing liquid metal heat-conducting filler | 深圳沃尔提莫电子材料有限公司 | 2023-03-10 | — | — | CN | claimed |
| CN-107488416-B | PET heat-conducting film containing liquid metal heat-conducting filler | 深圳沃尔提莫电子材料有限公司 | 2022-05-03 | — | — | CN | claimed |
| CN-107488436-B | Two-component heat-conducting silica gel sheet containing liquid metal heat-conducting filler | 深圳沃尔提莫电子材料有限公司 | 2022-04-22 | — | — | CN | claimed |
| CN-107488441-B | Liquid metal heat-conducting filler and preparation method thereof | 深圳沃尔提莫电子材料有限公司 | 2022-03-22 | — | — | CN | claimed |
| EP-3901998-B1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2025-10-15 | — | — | EP | disclosed |
| CN-118870740-A | Heat conducting material and preparation method and application thereof | 深圳市鸿富诚新材料股份有限公司 | 2024-10-29 | — | — | CN | disclosed |
| US-12107031-B2 | Thermal conductive silicone composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-10-01 | — | — | US | disclosed |
| US-20240059843-A1 | THERMAL GEL COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. | 2024-02-22 | — | — | US | disclosed |
| EP-4301805-A1 | THERMAL GEL COMPOSITION | Momentive Performance Materials Inc. (US) | 2024-01-10 | — | — | EP | disclosed |
| CN-116917379-A | Thermal gel composition | 迈图高新材料公司 | 2023-10-20 | — | — | CN | disclosed |
| WO-2022187569-A1 | THERMAL GEL COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-09-09 | — | — | WO | disclosed |
| US-20220044983-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-02-10 | — | — | US | disclosed |
| EP-3901998-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-27 | — | — | EP | disclosed |
| CN-111073100-A | Magnetic plastic and preparation method thereof | 广东科学技术职业学院 | 2020-04-28 | — | — | CN | disclosed |
| CN-106701031-A | Composite thermal interface material composed of metal mesh and low-melting-point alloy | 中电普瑞电力工程有限公司 | 2017-05-24 | — | — | CN | disclosed |
| CN-106675529-A | Composite thermal interface material of orientated pored graphene foam and low-melting-point alloy | 中电普瑞电力工程有限公司 | 2017-05-17 | — | — | CN | disclosed |