SCHEMBL2399585

SCHEMBL2399585

CCCCn1ccnc1-c1ccccc1

nearest known ligand 0.60

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 1/20 0.60
▸ ALDH1A1 P00352 1/20 0.59
▸ POLB P06746 1/20 0.59
▸ KMT2A Q03164 1/20 0.59
▸ TSHR P16473 2/20 0.56
▸ NR1H3 Q13133 1/20 0.49
▸ CYP3A4 P08684 2/20 0.48
▸ CYP2C19 P33261 2/20 0.48
▸ CYP2C9 P11712 1/20 0.48
▸ HIF1A Q16665 1/20 0.48
▸ TLR8 Q9NR97 4/20 0.47
▸ HSD11B1 P28845 2/20 0.46
▸ PLAA Q9Y263 1/20 0.44
▸ PDE4B Q07343 1/20 0.43
▸ BRD4 O60885 1/20 0.43
▸ ALPG P10696 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Iodide SCHEMBL10483028 0.98 ESR1 (0.59) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL3833947 0.95 ESR1 (0.59) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL28213135 0.94 ESR1 (0.57) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL29073255 0.94 ESR1 (0.57) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL11016233 0.94 ESR1 (0.57) ESR1ALDH1A1POLBKMT2ATSHR
Hexadecane SCHEMBL5816538 0.94 ESR1 (0.57) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL14675947 0.94 ESR1 (0.57) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL9444420 0.90 ESR1 (0.64) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL7095574 0.90 ESR1 (0.68) ESR1ALDH1A1POLBKMT2ATSHR
SCHEMBL27831726 0.87 KMT2A (0.59) ESR1ALDH1A1POLBKMT2ATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117080543-A Polyelectrolyte composition and preparation method thereof 科腾聚合物荷兰有限责任公司 2023-11-17 — — CN claimed
US-20210313857-A1 Corona Protection Tape for Electrical High-Voltage Machine SIEMENS AKTIENGESELLSCHAFT (DE) 2021-10-07 — — US claimed
CN-110692111-B Corona guard band for high voltage motor 弗兰德有限公司 2021-07-06 — — CN claimed
CN-110692111-A Corona guard band for high voltage motor 西门子股份公司 2020-01-14 — — CN claimed
WO-2018188843-A1 CORONA PROTECTION TAPE FOR ELECTRICAL HIGH-VOLTAGE MACHINE SIEMENS AKTIENGESELLSCHAFT (DE) 2018-10-18 — — WO claimed
EP-3389058-A1 CORONA SHIELDING BAND FOR ELECTRIC HIGH VOLTAGE MACHINE Siemens Aktiengesellschaft (DE) 2018-10-17 — — EP claimed
CN-117080543-A Polyelectrolyte composition and preparation method thereof 科腾聚合物荷兰有限责任公司 2023-11-17 — — CN disclosed
US-20210313857-A1 Corona Protection Tape for Electrical High-Voltage Machine SIEMENS AKTIENGESELLSCHAFT (DE) 2021-10-07 — — US disclosed
CN-110692111-B Corona guard band for high voltage motor 弗兰德有限公司 2021-07-06 — — CN disclosed
CN-110692111-A Corona guard band for high voltage motor 西门子股份公司 2020-01-14 — — CN disclosed
WO-2018188843-A1 CORONA PROTECTION TAPE FOR ELECTRICAL HIGH-VOLTAGE MACHINE SIEMENS AKTIENGESELLSCHAFT (DE) 2018-10-18 — — WO disclosed
EP-3389058-A1 CORONA SHIELDING BAND FOR ELECTRIC HIGH VOLTAGE MACHINE Siemens Aktiengesellschaft (DE) 2018-10-17 — — EP disclosed
US-8017670-B2 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same NITTO DENKO CORPORATION (JP) 2011-09-13 — — US disclosed
US-20100041799-A2 Epoxy Resin Composition for Optical-Semiconductor Encapsulation, Cured Resin Thereof, and Optical Semiconductor Device Obtained with the same NITTO DENKO CORPORATION (JP) 2010-02-18 — — US disclosed
EP-1903605-B1 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same NITTO DENKO CORP (JP) 2009-07-29 — — EP disclosed
US-20080114101-A1 Comprising an epoxy resin, a curing agent and a naphthalocyanine pigment; transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin; heat resistance; acid resistance; alkali resistance;discoloration inhibition; workability; molding materials NITTO DENKO CORPORATION (JP) 2008-05-15 — — US disclosed
EP-1903605-A1 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same NITTO DENKO CORPORATION (JP) 2008-03-26 — — EP disclosed
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