⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17554009 | 0.79 | — | — | |
| SCHEMBL448088 | 0.79 | — | — | |
| SCHEMBL1931868 | 0.79 | — | — | |
| SCHEMBL10753244 | 0.77 | — | — | |
| SCHEMBL3009536 | 0.73 | — | — | |
| SCHEMBL952657 | 0.72 | — | — | |
| SCHEMBL10338000 | 0.72 | — | — | |
| SCHEMBL19987908 | 0.70 | — | — | |
| SCHEMBL2495953 | 0.68 | — | — | |
| SCHEMBL8759522 | 0.68 | TSHR (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20020132061-A1 | Method for producing a porous coating | POLARIS INNOVATIONS LIMITED (IE) | 2002-09-19 | — | — | US | claimed |
| JP-1094904-A | — | — | None | — | — | JP | disclosed |
| WO-2025128333-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128307-A1 | POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128332-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128334-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| US-20250189892-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250188311-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250188312-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250188223-A1 | POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-6096482-A | Circuit substrate, circuit-formed suspension substrate, and production method thereof | NITTO DENKO CORPORATION (JP) | 2000-08-01 | — | — | US | disclosed |
| US-6068932-A | POLYCARBODIIMIDE WHICH IS SOLUBLE IN ORGANIC SOLVENTS AND POLYIMIDE WHICH IS SOLUBLE IN ORGANIC SOLVENTS. | NITTO DENKO CORPORATION (JP) | 2000-05-30 | — | — | US | disclosed |
| US-5858518-A | Circuit substrate, circuit-formed suspension substrate, and production method thereof | NITTO DENKO CORPORATION (JP) | 1999-01-12 | — | — | US | disclosed |
| EP-0869151-A2 | Thermosetting resin composition | NITTO DENKO CORPORATION (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5569689-A | MIXTURE OF VINYL CONTAINING POLYSILOXANE, ADHESION-PROMOTING SILICON-NITROGEN COMPUNND, HYDROSILATION CATALYST AND HYDRIDE POLYSILOXANE | GENERAL ELECTRIC COMPANY (US) | 1996-10-29 | — | — | US | disclosed |
| US-5569689-A | MIXTURE OF VINYL CONTAINING POLYSILOXANE, ADHESION-PROMOTING SILICON-NITROGEN COMPUNND, HYDROSILATION CATALYST AND HYDRIDE POLYSILOXANE | GENERAL ELECTRIC COMPANY (US) | 1996-10-29 | — | — | US | disclosed |
| JP-H0194904-A | PRODUCTION OF HOLLOW COMPOSITE MEMBRANE FOR SEPARATING GAS | TEIJIN LTD | 1989-04-13 | — | — | JP | disclosed |
| EP-0273443-A1 | Liquid-crystal display devices of twisted nematic type | SHARP KABUSHIKI KAISHA (JP) | 1988-07-06 | — | — | EP | disclosed |
| EP-0010657-B1 | SELECTIVE ETCHING OF POLYMERIC MATERIALS EMBODYING SILICONES VIA REACTOR PLASMAS | GENERAL ELECTRIC COMPANY (US) | 1984-09-19 | — | — | EP | disclosed |
| US-4209356-A | Selective etching of polymeric materials embodying silicones via reactor plasmas | GENERAL ELECTRIC COMPANY (US) | 1980-06-24 | — | — | US | disclosed |