SCHEMBL24225960

SCHEMBL24225960

O=C1OC[C@H]2C3CC(S)C(C3)C12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21567780 1.00
SCHEMBL21567778 0.85
SCHEMBL22186650 0.80
SCHEMBL21567746 0.80
SCHEMBL12149473 0.77
SCHEMBL19901753 0.77
SCHEMBL10158301 0.77
SCHEMBL21910756 0.77
SCHEMBL10209854 0.77
SCHEMBL11988728 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220026801-A1 CHEMICALLY AMPLIFIED POSITIVE -TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD (JP) 2022-01-27 US disclosed