SCHEMBL24254789

SCHEMBL24254789

NC1(N)CCC(N)(N)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL503093 0.94
Ammonia Solution, Strong SCHEMBL8002516 0.88
SCHEMBL425274 0.82
SCHEMBL11319175 0.78
SCHEMBL1325359 0.75 TSHR (0.38)
SCHEMBL6901372 0.75 TSHR (0.38)
SCHEMBL8672905 0.75 TSHR (0.38)
SCHEMBL1357086 0.75 TSHR (0.38)
SCHEMBL9515548 0.75
Cyclohexane SCHEMBL732752 0.75 TSHR (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025100202-A1 POLYIMIDE, AND POLYIMIDE THIN FILM 本州化学工業株式会社 2025-05-15 WO disclosed
EP-4198163-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN Tosoh Corporation (JP) 2023-06-21 EP disclosed
WO-2022034907-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN 東ソー株式会社 2022-02-17 WO disclosed
CN-104321377-A Urea Compounds for Improving Solid State Properties of Polyamide Resins BASF SE 2015-01-28 CN disclosed