SCHEMBL24256023

SCHEMBL24256023

CC1(C)c2ccccc2-c2ccc(N(c3ccccc3)c3cc(-c4nc(-c5ccccc5)c5oc6ccccc6c5n4)cc4oc5cc6ccccc6cc5c34)cc21

nearest known ligand 0.34

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.34
MAPT P10636 8/20 0.33
LMNA P02545 4/20 0.33
KMT2A Q03164 3/20 0.33
POLB P06746 2/20 0.33
HTT P42858 1/20 0.33
ALDH1A1 P00352 7/20 0.32
KDM4E B2RXH2 4/20 0.32
TERT O14746 2/20 0.32
HSD17B10 Q99714 3/20 0.31
USP2 O75604 1/20 0.31
MAPK1 P28482 1/20 0.31
HPGD P15428 2/20 0.30
MEN1 O00255 2/20 0.30
GAA P10253 1/20 0.30
NPSR1 Q6W5P4 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24255461 0.90 MAPT (0.33) TSHRMAPTLMNAKMT2APOLB
SCHEMBL24255543 0.88
SCHEMBL24255712 0.87 MAPT (0.36) TSHRMAPTLMNAKMT2APOLB
SCHEMBL24256019 0.87
SCHEMBL24256030 0.86
SCHEMBL23597511 0.85 MAPT (0.32) TSHRMAPTLMNAKMT2APOLB
SCHEMBL24255628 0.84 TSHR (0.31) TSHRTERT
SCHEMBL24255540 0.84 MAPT (0.35) TSHRMAPTLMNAKMT2APOLB
SCHEMBL27049560 0.83
SCHEMBL26571749 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230337529-A1 ORGANIC LIGHT-EMITTING DEVICE AND COMPOSITION FOR FORMING ORGANIC MATERIAL LAYER LT MATERIALS CO., LTD. (KR) 2023-10-19 US disclosed
US-20230337529-A1 ORGANIC LIGHT-EMITTING DEVICE AND COMPOSITION FOR FORMING ORGANIC MATERIAL LAYER LT MATERIALS CO., LTD. (KR) 2023-10-19 US disclosed
WO-2022035097-A1 ORGANIC LIGHT-EMITTING DEVICE AND COMPOSITION FOR FORMING ORGANIC MATERIAL LAYER 엘티소재주식회사 2022-02-17 WO disclosed