SCHEMBL2435586

SCHEMBL2435586

O=C(O)c1cccc(C(=O)c2ccc(C(=O)O)c(C(=O)O)c2C(=O)O)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.58
HSD17B10 Q99714 2/20 0.55
CDC25A P30304 1/20 0.55
CDC25B P30305 1/20 0.55
POLB P06746 1/20 0.53
AKR1C3 P42330 1/20 0.52
ATM Q13315 1/20 0.50
TDP1 Q9NUW8 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
CA1 P00915 2/20 0.47
CA2 P00918 2/20 0.47
CA9 Q16790 2/20 0.47
CA12 O43570 1/20 0.47
CA6 P23280 1/20 0.47
ALDH1A1 P00352 1/20 0.45
CYP2C9 P11712 2/20 0.44
CYP2C8 P10632 2/20 0.44
KMO O15229 1/20 0.44
CYP1A2 P05177 1/20 0.44
HPGD P15428 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7890067 0.91 KDM4E (0.49) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL426276 0.89 AKR1C3 (0.61) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL2058538 0.85 AKR1C3 (0.73) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL809324 0.84 AKR1C3 (0.72) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL6056938 0.82 AKR1C3 (0.69) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL6057040 0.82 AKR1C3 (0.69) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL11452607 0.81 CDC25B (0.75) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL1294741 0.80 SRD5A2 (0.58) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL27339882 0.80 AKR1C3 (0.79) KDM4EHSD17B10CDC25ACDC25BPOLB
SCHEMBL64990 0.80 CDC25B (0.79) KDM4EHSD17B10CDC25ACDC25BPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 149 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2612879-A1 POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING SAME Mitsui Chemicals, Inc. (JP) 2013-07-10 EP claimed
CN-118251632-A Photosensitive resin composition, cured product, method for producing cured product, organic EL display device, and display device 东丽株式会社 2024-06-25 CN disclosed
CN-118077312-A Organic EL display device 东丽株式会社 2024-05-24 CN disclosed
CN-111538209-B Photosensitive resin composition, organic EL element partition wall, and organic EL element 日保丽公司 2024-05-14 CN disclosed
CN-117858921-A Resin composition, cured product, organic EL display device, and method for producing cured product 东丽株式会社 2024-04-09 CN disclosed
CN-112654927-B Photosensitive resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, semiconductor device, and method for producing organic EL display device 东丽株式会社 2024-02-27 CN disclosed
US-20240006715-A1 SOLID ELECTROLYTE LAMINATED SHEET, ALL-SOLID STATE SECONDARY BATTERY, AND MANUFACTURING METHOD FOR ALL-SOLID STATE SECONDARY BATTERY FUJIFILM CORPORATION (JP) 2024-01-04 US disclosed
CN-117222682-A Cured resin composition and cured product thereof 日本化药株式会社 2023-12-12 CN disclosed
CN-117098789-A Maleimide resin mixture, curable resin composition, prepreg, and cured product thereof 日本化药株式会社 2023-11-21 CN disclosed
CN-117043676-A Positive photosensitive pigment composition, cured film containing cured product thereof, and organic EL display device 东丽株式会社 2023-11-10 CN disclosed
US-6513986-B2 Electrical pittingproof rolling bearing NTN CORPORATION (JP) 2003-02-04 US disclosed
US-6509125-B1 Colored layers containing a dye-bonded polymer TOPPAN PRINTING CO., LTD. (JP) 2003-01-21 US disclosed
US-6103864-A SOLUTION FOR POLYMERIZATION OF MONOMERIC REACTANTS (PMR) CONTAINING LOW BOILING SOLVENT, AROMATIC DI- OR POLY-AMINE, AND CARBOXY ACID-PARTIAL ESTER HAVING HIGHER SECONDARY ALKYL ESTER GROUPS; FIBER REINFORCED COMPOSITES, AIRCRAFT THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2000-08-15 US disclosed
EP-0605112-B1 Use of an insulating adhesive tape, lead frame and semiconductor device employing the tape MITSUI CHEMICALS INC (JP) 1999-03-17 EP disclosed
EP-0900406-A1 POLYIMIDE ANGULARITY ENHANCEMENT LAYER MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-03-10 EP disclosed
US-5707749-A POLYIMIDE, BISPHENOL ETHER BISMALEIMIDE ADHESIVE HITACHI, LTD. (JP) 1998-01-13 US disclosed
WO-1997044704-A1 POLYIMIDE ANGULARITY ENHANCEMENT LAYER MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-11-27 WO disclosed
US-5406124-A Thermoplastic polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1995-04-11 US disclosed
US-5252534-A Slipping layer of polyimide-siloxane for dye-donor element used in thermal dye transfer EASTMAN KODAK COMPANY (US) 1993-10-12 US disclosed
US-4847353-A POLYAMIDEIMIDE COPOLYMERS NIPPON STEEL CHEMICAL CO., LTD. (JP) 1989-07-11 US disclosed