⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9617882 | 0.89 | — | — | |
| SCHEMBL6887217 | 0.87 | — | — | |
| SCHEMBL27910168 | 0.75 | — | — | |
| SCHEMBL27975524 | 0.75 | — | — | |
| SCHEMBL9099753 | 0.75 | — | — | |
| SCHEMBL9763355 | 0.75 | — | — | |
| SCHEMBL28692021 | 0.75 | — | — | |
| SCHEMBL2858425 | 0.71 | — | — | |
| SCHEMBL4413536 | 0.67 | — | — | |
| SCHEMBL29279459 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101220471-B | Chemical plating reinforcing method and apparatus for airborne tank internal surface protection | UNIV SOUTH CHINA TECH | 2011-04-06 | — | — | CN | claimed |
| CN-101220471-A | Chemical plating reinforcing method and apparatus for airborne tank internal surface protection | UNIV SOUTH CHINA TECH (CN) | 2008-07-16 | — | — | CN | claimed |
| JP-4274389-A | — | — | None | — | — | JP | disclosed |
| WO-2023204160-A1 | UNIT-INSERTABLE/REMOVABLE TOXIC OBJECT REDUCING/ELIMINATING DEVICE | Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 | 2023-10-26 | — | — | WO | disclosed |
| WO-2023204194-A1 | ELECTROMAGNETIC WAVE BLOCKING FILTER | Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 | 2023-10-26 | — | — | WO | disclosed |
| US-20130216721-A1 | Process for Electroless Deposition on Magnesium Using a Nickel Hydrate Plating Bath | UNIVERSITY OF WINDSOR (CA) | 2013-08-22 | — | — | US | disclosed |
| CN-102264951-A | Rolled copper foil or electrolytic copper foil for electronic circuit and method for forming electronic circuit using the same | — | 2011-11-30 | — | — | CN | disclosed |
| US-20110259848-A1 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same | JX NIPPON MINING & METALS CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| EP-2371995-A1 | ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT AND METHOD OF FORMING ELECTRONIC CIRCUIT USING SAME | JX Nippon Mining & Metals Corporation (JP) | 2011-10-05 | — | — | EP | disclosed |
| CN-101220471-B | Chemical plating reinforcing method and apparatus for airborne tank internal surface protection | UNIV SOUTH CHINA TECH | 2011-04-06 | — | — | CN | disclosed |
| CN-101220471-A | Chemical plating reinforcing method and apparatus for airborne tank internal surface protection | UNIV SOUTH CHINA TECH (CN) | 2008-07-16 | — | — | CN | disclosed |
| JP-H04274389-A | COPPER FOIL FOR PRINTED CIRCUIT BOARD | FURUKAWA SAAKITSUTO FOIL KK | 1992-09-30 | — | — | JP | disclosed |