SCHEMBL2473459

SCHEMBL2473459

[Al-3].[Al-3].[Ni+2].[Ni+2].[Ni+2].[Pt].[Pt].[Pt]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL716225 0.82
SCHEMBL9764666 0.67
SCHEMBL2396525 0.67
SCHEMBL11789180 0.58
SCHEMBL3927799 0.58 KDM3A (1.00)
SCHEMBL8066885 0.58
SCHEMBL5200948 0.58
SCHEMBL10903486 0.58
SCHEMBL176391 0.58
SCHEMBL9297420 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1172460-B1 A METHOD FOR APPLYING A HIGH-TEMPERATURE BOND COAT ON A METAL SUBSTRATE GEN ELECTRIC (US) 2017-03-15 EP claimed
US-20140311918-A1 MULTI-STEP ELECTROCHEMICAL STRIPPING METHOD GENERAL ELECTRIC COMPANY (US) 2014-10-23 US claimed
US-7654734-B2 Methods and devices for evaluating the thermal exposure of a metal article GENERAL ELECTRIC COMPANY (US) 2010-02-02 US claimed
US-20060256833-A1 Methods and devices for evaluating the thermal exposure of a metal article GENERAL ELECTRIC COMPANY 2006-11-16 US claimed
US-20060141160-A1 Oxidation-resistant coatings bonded to metal substrates, and related articles and processes HASZ WAYNE C 2006-06-29 US claimed
US-7029721-B2 Method for applying a high-temperature bond coat on a metal substrate, and related compositions and articles GENERAL ELECTRIC COMPANY (US) 2006-04-18 US claimed
US-6921582-B2 Oxidation-resistant coatings bonded to metal substrates, and related articles and processes GENERAL ELECTRIC COMPANY (US) 2005-07-26 US claimed
US-20050064220-A1 OXIDATION-RESISTANT COATINGS BONDED TO METAL SUBSTRATES, AND RELATED ARTICLES AND PROCESSES GENERAL ELECTRIC COMPANY 2005-03-24 US claimed
US-20040142112-A1 Method for applying a high-temperature bond coat on a metal substrate, and related compositions and articles ENERGY, UNITED STATES DEPARTMENT OF 2004-07-22 US claimed
US-6637643-B2 Method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles GENERAL ELECTRIC COMPANY 2003-10-28 US claimed
US-20030024430-A1 Method for applying a high-temperature bond coat on a metal substrate, and related compositions and articles HASZ WAYNE CHARLES (US) 2003-02-06 US claimed
US-6497758-B1 Method for applying a high-temperature bond coat on a metal substrate, and related compositions and articles GENERAL ELECTRIC COMPANY 2002-12-24 US claimed
US-20020102409-A1 Method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles ENERGY, UNITED STATES DEPARTMENT OF 2002-08-01 US claimed
US-6413582-B1 Method for forming metallic-based coating GENERAL ELECTRIC COMPANY 2002-07-02 US claimed
US-6387527-B1 Method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles GENERAL ELECTRIC COMPANY 2002-05-14 US claimed
EP-1172460-A2 A method for applying a high-temperature bond coat on a metal substrate GENERAL ELECTRIC COMPANY (US) 2002-01-16 EP claimed
EP-1091020-A1 A method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles GENERAL ELECTRIC COMPANY (US) 2001-04-11 EP claimed
CN-107037065-B Coating inspection method 通用电气公司 2021-06-22 CN disclosed
EP-1162286-A1 A method for removing a coating from a substrate GENERAL ELECTRIC COMPANY (US) 2001-12-12 EP disclosed
EP-1079002-A1 A method for applying coatings on substrates GENERAL ELECTRIC COMPANY (US) 2001-02-28 EP disclosed